Dual-Sided Electronic Component Package Against Ion Migration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component packages face challenges in achieving superior operational reliability due to ion migration phenomena, particularly when using silver-based plated layers, which can lead to insulation breakdown and leakage currents.
Innovation Solution
The use of metal materials like gold, palladium, or nickel in the plated layers, which are less prone to ion migration, along with insulating layers to isolate and power separate electronic component chips, ensuring independent operation and redundancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver (Ag) is used in the plated layers, then electrical conductivity is improved, but ion migration phenomenon occurs leading to insulation breakdown and leakage currents
Solution Approach 1:
The patent changes the material parameter of the plated layer from silver (Ag) to alternative metals such as copper (Cu), nickel (Ni), or their alloys. This material substitution eliminates the ion migration phenomenon while maintaining electrical conductivity, directly resolving the technical contradiction between reliability and harmful ion migration effects.
2Productivity
If multiple electronic component chips are mounted on a single lead frame, then productivity is improved, but insulation breakdown risk increases due to potential leakage currents
Solution Approach 1:
By changing the plated layer material from silver to ion-migration-resistant metals, the patent eliminates the root cause of leakage currents. This enables safe mounting of multiple electronic component chips on a single lead frame, simultaneously achieving high productivity through increased mounting density and maintained reliability through stable insulation between adjacent chips.
Data Source
AI summary
An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).