Dual-Sided Electronic Package With Embedded Conductive Posts
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Solution Overview
Problem
Existing wafer level packaging technologies limit the functionality and efficiency of semiconductor packages due to the placement of semiconductor elements on a single side of the circuit structure, restricting the performance of end electronic products.
Innovation Solution
The proposed solution involves an electronic package design with a first and second encapsulant, conductive posts, and circuit structures on both surfaces, allowing a first and second electronic component to be arranged on opposite sides of a circuit structure, enhancing multi-functionality and efficiency by electrical connections through conductive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor elements are disposed on a single side of the circuit structure using conventional WLP technologies, then the manufacturing process is simple, but the functionality and efficiency of the semiconductor package are limited
Solution Approach 1:
The patent transitions from single-sided component placement to dual-sided component placement by adding a second circuit structure on the opposite side of the first encapsulant. This dimensional change allows semiconductor elements to be disposed on both the first and second sides, effectively utilizing three-dimensional space and doubling the functional capacity of the package without significantly increasing manufacturing complexity
2Productivity
If semiconductor elements are disposed on a single side of the circuit structure, then the device structure is simple, but the efficiency of the semiconductor package is limited
Solution Approach 1:
The patent divides the package into two functional segments: a first circuit structure on one side of the encapsulant and a second circuit structure on the opposite side. Each segment can independently host semiconductor elements and perform specific functions, allowing parallel operation and improved overall efficiency while maintaining manageable complexity through modular design
3Reliability
If conventional single-sided packaging is used, then the manufacturing process is straightforward, but the performance of end electronic products is restricted
Solution Approach 1:
The patent employs preliminary actions in the fabrication process by first forming the first encapsulant and first circuit structure, then adding the second circuit structure and second semiconductor elements in subsequent steps. This staged approach allows each layer to be manufactured and tested independently before integration, improving overall product reliability while keeping the fabrication process systematic and manageable
Data Source
AI summary
An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.