Dual-Sided Semiconductor Package for Controller-Memory Thermal Separation
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Solution Overview
Problem
Conventional semiconductor device packages face challenges in managing heat generated by high power density controller dice, which leads to increased temperatures and performance degradation of memory dice, particularly due to inadequate thermal management and larger form factors.
Innovation Solution
The solution involves positioning lower heat-generating memory dice on one side of a substrate opposite a higher heat-generating controller die, with different encapsulant materials used to manage heat flow and locate the controller die closer to conductive elements, thereby redirecting heat away from memory dice and reducing package size and height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If controller die is positioned under or adjacent to memory die stack, then electrical connectivity and signal transmission are improved, but heat generated by controller die increases temperature of memory die causing performance degradation
Solution Approach 1:
The patent transitions from planar (2D) arrangement to three-dimensional (3D) arrangement by stacking controller die and memory die in vertical layers. This dimensional change allows electrical connectivity to be maintained through vertical interconnects while spatially separating heat-generating components in the vertical dimension, reducing thermal coupling between controller and memory die.
Solution Approach 2:
The patent divides the package into distinct functional layers or segments: a first stack containing controller die and a second stack containing memory die. This segmentation separates the high-power controller function from the temperature-sensitive memory function into different spatial zones, allowing independent thermal management for each segment while maintaining electrical connectivity through controlled inter-stack interconnects.
2Adaptability or versatility
If conventional package designs are used with controller die under or adjacent to memory die stack, then device functionality is achieved, but package height and footprint become undesirably large
Solution Approach 1:
The patent implements nesting by placing controller die within or adjacent to the memory die stack structure, with controller die positioned in a recess or cavity formed in the substrate or memory die stack. This nested arrangement allows the controller to be accommodated within the vertical profile of the package rather than adding to the footprint or overall height, achieving compact integration while maintaining all required functionality.
3Speed
If controller die is positioned close to memory die for electrical connectivity, then signal transmission is improved, but heat conduction from controller die to memory die increases junction temperatures
Solution Approach 1:
The patent applies different material properties to different regions: electrically conductive materials are used for vertical interconnects between stacks to ensure fast signal transmission, while thermally insulating materials are used in the horizontal substrate plane to block heat conduction paths from controller die to memory die. This local differentiation of material quality allows simultaneous optimization of electrical connectivity and thermal isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat generated by both types of dice, maintaining recommended junction temperatures and reducing the need for performance throttling, while also minimizing package size and improving operational speed and signal quality.
Implementation Method 1
heat generated by the comparatively higher power density controller die 502 or 602 may transfer through conduction to the memory dice 504 or 604
Implementation Method 2
different encapsulant materials used to manage heat flow and locate the controller die closer to conductive elements, thereby redirecting heat away from memory dice
Data Source
AI summary
Semiconductor devices and semiconductor device packages may include at least one first semiconductor die supported on a first side of a substrate. The at least one first semiconductor die may include a first active surface. A second semiconductor die may be supported on a second, opposite side of the substrate. The second semiconductor die may include a second active surface located on a side of the second semiconductor die facing the substrate. The second semiconductor die may be configured to have higher median power consumption than the at least one first semiconductor die during operation. An electronic system incorporating a semiconductor device package is disclosed, as are related methods.