Dual-Sided PCB Thermal Capture for High-Frequency Computing
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Solution Overview
Problem
Modern electronic devices face challenges in thermal management due to increased heat generation from higher processing frequencies, leading to potential throttling and space constraints in smaller form factors, where existing cooling solutions are inadequate in efficiently dissipating heat while maintaining compact designs.
Innovation Solution
The design incorporates a multi-part housing with a heat removal assembly that includes a heat exchanger and air movers, along with a thermal capture system using vapor chambers, heat pipes, and fin stacks on opposing surfaces of the circuit board, allowing for efficient airflow and heat dissipation, while also incorporating RF-blocking materials to manage electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If processing circuitry operates at higher frequencies to increase computing capabilities, then computation speed and video quality are improved, but thermal energy generation increases causing throttling and potential damage
Solution Approach 1:
The patent transitions from traditional single-sided cooling to a dual-sided cooling architecture where heat capture assemblies are positioned on both opposing surfaces of the circuit board. This dimensional expansion allows heat to be extracted from both sides of the PCB simultaneously, effectively doubling the cooling capacity and enabling higher processing frequencies without thermal throttling.
Solution Approach 2:
The patent introduces heat capture assemblies including vapor chambers and heat pipes as intermediary thermal management components. These intermediaries are positioned between the heat-generating circuitry and the heat exchangers, facilitating efficient heat transfer from the PCB traces and components to the cooling system, thereby managing thermal energy at higher operating frequencies.
2Volume of moving object
If device form factor is reduced to create smaller devices, then portability is improved, but components must be located closer together and heated air occupies greater portion of internal space
Solution Approach 1:
The patent utilizes the z-dimension (vertical space) by implementing heat capture assemblies on both top and bottom surfaces of the circuit board. This approach extracts heat from both sides of the PCB, effectively utilizing the third dimension for thermal management and reducing the horizontal space required for cooling components, thereby enabling smaller device form factors.
Solution Approach 2:
The patent integrates heat capture assemblies, heat exchangers, and air movers within the existing device housing and circuit board structure. The cooling components are nested within the device's internal volume, with heat capture assemblies positioned directly on the PCB surfaces and heat exchangers integrated into the housing, maximizing space utilization without increasing device footprint.
3Device complexity
If traditional single-sided cooling is used, then device simplicity is maintained, but heat dissipation is insufficient for high-frequency operation
Solution Approach 1:
The patent segments the cooling system into distinct functional modules: heat capture assemblies (vapor chambers and heat pipes) positioned on both sides of the PCB, heat exchangers integrated into the housing, and air movers for airflow generation. This segmentation allows each component to be optimized for its specific function while working together as an integrated thermal management system, achieving superior heat dissipation without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances thermal efficiency, prevents throttling, and optimizes space usage by allowing for compact designs that maintain performance, reducing noise, and improving airflow within the device.
Implementation Method 1
heat exchanger
Implementation Method 2
air flows between the first internal volume and the second internal volume
Implementation Method 3
air mover that is capable of moving an amount of air from the first internal volume, through a heat exchanger, and to the external environment
Implementation Method 4
heat capture assembly in thermal communication with the heat exchanger
Implementation Method 5
vapor chambers
Implementation Method 6
second openings that allow air to pass between an external environment and the second internal volume wherein the second openings are characterized as having a size, a shape, and a pitch so as to restrict passage of radio frequency (RF) electromagnetic energy therethrough
Data Source
AI summary
This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.