Dual-Sided RF Module Packaging With Encapsulated Two-Side Integration
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Solution Overview
Problem
Current packaged modules for radio-frequency applications often face challenges in efficiently integrating and encapsulating components on both sides of a substrate while maintaining effective electrical connectivity and electromagnetic shielding.
Innovation Solution
A dual-sided packaged module design featuring a redistribution layer with first and second sides, where each side has a component mounted and encapsulated by a mold structure, along with conductive mounting structures and an electromagnetic shielding layer, allowing for exposed mounting surfaces and efficient electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If components are mounted on both sides of the substrate to increase integration density, then the quantity of components per module is improved, but the complexity of encapsulation and maintaining electrical connectivity worsens
Solution Approach 1:
The module is divided into two separate side portions (first-side portion and second-side portion), each with its own mold structure and component assembly. This segmentation allows independent encapsulation and processing of each side, reducing the overall complexity while maintaining high component density.
Solution Approach 2:
The redistribution layer is implemented as a multi-layer structure with outermost layers on both sides of the substrate. This three-dimensional arrangement of conductive pathways enables electrical connectivity between components on opposite sides without requiring complex through-substrate vias, simplifying the interconnection architecture.
2Reliability
If mold structures encapsulate components on both sides to provide protection and structural integrity, then the reliability is improved, but the manufacturing precision required worsens
Solution Approach 1:
Separate mold structures are used for each side of the substrate, allowing each mold to be optimized and processed independently. This reduces the cumulative tolerance errors that would arise from a single complex multi-side mold, making it easier to achieve the required encapsulation precision.
Solution Approach 2:
The mold structures are formed to define surfaces before final assembly and thinning operations. This preliminary formation of precise mold cavities allows for better control of encapsulation geometry, and subsequent thinning operations can be performed with controlled precision to achieve the final thickness tolerances.
3Ease of operation
If the module is thinned to provide exposed mounting surfaces for conductive features, then the ease of operation is improved, but the manufacturing precision required worsens
Solution Approach 1:
The mold structures are formed with precise dimensions before the thinning operation. This preliminary precision in mold cavity formation establishes a reference framework that guides the subsequent thinning process, allowing controlled removal of material to achieve the desired final thickness and exposed mounting surfaces.
Solution Approach 2:
The multi-layer redistribution layer structure provides additional conductive pathways and grounding layers that compensate for the reduced material thickness. This dimensional redistribution of electrical functions allows the module to be thinned while maintaining electrical performance and providing exposed mounting surfaces.
4Reliability
If electromagnetic shielding is added to cover all sides to improve RF performance, then the reliability is improved, but the device complexity worsens
Solution Approach 1:
The electromagnetic shielding layer is integrated with the mold structures and substrate assembly, combining multiple functions (encapsulation, structural support, and EM shielding) into a unified structure. This merging reduces the number of separate components and assembly steps, lowering overall device complexity while maintaining shielding effectiveness.
Solution Approach 2:
The conductive shielding layer serves multiple functions: it provides electromagnetic shielding for RF performance, acts as a ground reference plane, and integrates with the mold structures for mechanical support. This multi-functionality reduces the need for separate dedicated shielding components, simplifying the overall device architecture.
Data Source
AI summary
A dual-sided module can include a redistribution layer having first and second sides, and a first-side portion implemented on the first side of the redistribution layer and including a first component mounted on the first side of the redistribution layer, and a first mold structure implemented to at least partially encapsulate the first component. The dual-sided module can further include a second-side portion implemented on the second side of the redistribution layer and including a second component mounted on the second side of the redistribution layer, a plurality of conductive mounting structures, and a second mold structure implemented to at least partially encapsulate the second component. The second mold structure can further encapsulate the conductive mounting features while providing respective exposed mounting surfaces of the conductive mounting features.