Dual-Sided RF Modules with Through-Mold Openings and Conductive Shielding
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Solution Overview
Problem
Current packaging technologies for radio-frequency (RF) modules lack effective shielding and mounting solutions, particularly for dual-sided modules with ball grid arrays, which can lead to inefficiencies in shielding and integration with circuit boards.
Innovation Solution
A dual-sided module design featuring a packaging substrate with RF circuit assemblies on both sides, covered by overmolds with through-mold openings and conductive layers for shielding, and solder balls for mounting, allowing for intra-module and external shielding, as well as secure attachment to circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional packaging technologies are used for RF modules, then the structure is simple, but shielding effectiveness is insufficient
Solution Approach 1:
The patent merges the shielding function with the packaging structure by integrating conductive shielding layers directly into the overmolded packaging material. This combination eliminates the need for separate shielding components while achieving effective RF shielding, thus improving shielding effectiveness without proportionally increasing device complexity
Solution Approach 2:
The patent uses composite materials by incorporating conductive materials (such as metal particles, fibers, or coatings) into the packaging substrate and overmold materials. This creates a composite packaging structure that simultaneously provides mechanical protection and electromagnetic shielding, resolving the contradiction between simple structure and effective shielding
2Object-affected harmful factors
If additional shielding components are added to improve shielding, then shielding effectiveness increases, but manufacturing complexity increases
Solution Approach 1:
The shielding function is merged into the packaging manufacturing process itself. Conductive layers are integrated into the overmolded structure, allowing shielding to be created during the same manufacturing steps as packaging, thereby eliminating additional manufacturing processes and reducing overall manufacturing complexity
Solution Approach 2:
The packaging structure serves dual purposes: it provides mechanical protection and simultaneously creates the shielding effect through its integrated conductive features. This self-service approach means the packaging structure itself performs the shielding function without requiring separate shielding components or additional assembly steps
3Adaptability or versatility
If dual-sided RF circuit assemblies are implemented, then functionality is improved, but integration with circuit boards becomes more difficult
Solution Approach 1:
The patent segments the dual-sided module into distinct functional regions with dedicated contact areas on each side. The overmolded structure creates separate zones for different contact types (solder balls, contact pads, through-mold openings), making it easier to integrate with circuit boards despite the dual-sided complexity by providing clearly defined interaction points
Data Source
AI summary
Modules, devices and methods of manufacturing a dual-sided module are disclosed. A dual-sided module includes a packaging substrate having an upper side, a lower side, and a ground plane, a radio-frequency circuit assembly implemented on both of the upper and lower sides of the packaging substrate and an upper overmold implemented on the upper side of the packaging substrate defining one or more openings dimensioned to expose contact pads on the upper side. The module further includes a conductive layer configured to provide shielding for a region on the upper side of the packaging substrate, a lower overmold implemented on the lower side of the packaging substrate to cover a lower portion of the radio-frequency circuit assembly, the lower overmold defining a plurality of openings, and a contact feature implemented within each of the openings of the lower overmold to be in contact with the packaging substrate.