Dual-Sided Semiconductor Module With Preliminary Wire Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional double-sided surface mount circuit modules face challenges in handling and inspection, leading to unreliable modules due to wire bonding issues, wastage of semiconductor elements, and reliability concerns in high-performance, thin-type packages under harsh environments.
Innovation Solution
A semiconductor module design featuring a conductive island with leads and a resin sealing body, where semiconductor elements are mounted on both sides of a circuit board, with a second sealing resin providing double protection and improved heat dissipation, allowing for easier inspection and reduced wastage by sealing the elements before mounting sensors or circuit elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed after mounting semiconductor elements on both surfaces, then electrical connection is achieved, but handling becomes difficult due to risk of wire contact with outside
Solution Approach 1:
The patent applies preliminary action by performing wire bonding before mounting the semiconductor elements on both surfaces. This sequence ensures that the thin metallic wires are already in place and protected within the resin sealant before the elements are mounted, eliminating the handling difficulty of exposed wires after dual-sided mounting.
2Productivity
If semiconductor elements are mounted on both surfaces simultaneously, then manufacturing efficiency is improved, but inspection and failure analysis become difficult
Solution Approach 1:
The patent applies segmentation by separating the mounting process into two stages: first mounting elements on one surface and performing wire bonding, then mounting elements on the other surface. This segmentation allows inspection and failure analysis of the first surface before proceeding to the second surface, while still achieving efficient dual-sided manufacturing.
3Productivity
If joint of first semiconductor element fails, then second semiconductor element is wasted, but simultaneous mounting reduces manufacturing time
Solution Approach 1:
The patent applies preliminary action by completing wire bonding and inspection of the first semiconductor element before mounting the second semiconductor element. This ensures that if the first element's joint fails, the second element has not yet been mounted and can be reused, reducing wastage while maintaining manufacturing efficiency.
4Reliability
If thin type package with stacked chips is used, then high-performance circuit is achieved, but substrate warpage and sealing resin thickness problems occur
Solution Approach 1:
The patent applies dimensionality change by transitioning from a vertical stacked chip configuration to a horizontal dual-sided mounting configuration. This allows high-performance circuits to be achieved through parallel arrangement on both surfaces of the substrate, reducing the thickness requirements and minimizing substrate warpage while maintaining circuit performance.
Data Source
AI summary
A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.