Dual-Sided Socket Corrugation Structure for Stable Separable Coupling
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Solution Overview
Problem
Existing connector devices, such as LGA and LIF connectors, face challenges in maintaining stable electrical connections due to the need for complex loading mechanisms and high costs, while also limiting bandwidth scaling and complicating customer implementation.
Innovation Solution
A dual-sided socket device with metallization structures forming corrugation structures that facilitate low insertion force coupling by using conductive contacts extending from the socket body structure, eliminating the need for additional loading mechanisms and enhancing coupling strength through horizontal deflection and friction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If LGA connectors are used to provide fully separable connection, then connection separability is improved, but device complexity increases due to additional loading mechanisms
Solution Approach 1:
The patent removes the complex loading mechanism from the connector design. The corrugation structures are formed directly from the metallization structures themselves, extracting the loading function from a separate mechanism and integrating it into the basic connector structure, thereby simplifying the overall device while maintaining separability.
Solution Approach 2:
The patent combines the electrical connection function and the mechanical loading function into a single integrated structure. The metallization structures serve dual purposes: providing electrical conductivity and forming corrugation structures that provide mechanical loading, eliminating the need for separate loading mechanisms.
2Reliability
If additional loading mechanisms are added to LGA connectors to maintain stable electrical connection, then connection stability is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the electrical connection function and mechanical loading function into a single integrated structure. The metallization structures serve dual purposes: providing electrical conductivity and forming corrugation structures that provide mechanical loading, eliminating the need for separate loading mechanisms and reducing manufacturing cost.
Solution Approach 2:
The metallization structures are designed to perform multiple functions simultaneously: electrical conduction, mechanical support, and providing loading force through corrugation. This multi-functionality reduces the number of separate components needed, simplifying manufacturing and reducing cost.
3Reliability
If additional loading mechanisms are used to maintain sustained normal force, then connection reliability is improved, but bandwidth scaling capability deteriorates
Solution Approach 1:
The corrugation structures provide dynamic mechanical loading that adapts to different connection requirements. The spring-like corrugations can accommodate varying forces and displacements, allowing the connector to maintain reliable electrical contact while supporting different bandwidth configurations without requiring additional loading mechanisms.
4Device complexity
If LIF connectors are used to eliminate loading mechanisms, then device complexity is reduced, but connection separability deteriorates due to surface mounting requirements
Solution Approach 1:
The patent segments the connector into distinct plug and receptacle portions, each with corrugation structures that facilitate easy separation. The corrugation structures are designed to engage and disengage smoothly, allowing the connector to be separated without requiring complex loading mechanisms or permanent surface mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-sided socket device provides a stable and cost-effective electrical connection with reduced complexity, enabling easy separation and improved bandwidth scaling by utilizing corrugation structures for enhanced coupling strength without additional loading mechanisms.
Implementation Method 1
enhancing coupling strength through horizontal deflection and friction
Implementation Method 2
horizontal deflection
Data Source
AI summary
Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.