Dual-Sided Substrate Deposition Apparatus for 3D Wiring
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Solution Overview
Problem
Conventional technologies lack a specific apparatus and method for depositing wiring on the lateral surfaces of substrates with low resistance and excellent electrical properties, which is essential for bezel-less substrates requiring three-dimensional deposition uniformity and quality.
Innovation Solution
A deposition apparatus featuring a substrate mounting drum with inside and outside source targets for simultaneous deposition on both lateral portions of a substrate, along with a cooling system and substrate mounting jig, allowing for sputtering-based wiring deposition while minimizing contamination and optimizing deposition efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional single-sided deposition is used, then the apparatus structure is simple, but the deposition time and cost increase due to sequential processing of both lateral portions
Solution Approach 1:
The substrate is divided into two lateral portions, with each portion having its own dedicated source target (inside source target for first lateral portion, outside source target for second lateral portion). This segmentation allows independent simultaneous deposition on both portions, doubling the productivity without requiring a single complex multi-functional target system.
Solution Approach 2:
The invention transitions from conventional single-sided deposition to dual-sided simultaneous deposition by adding the inside source target within the substrate mounting drum and the outside source target outside the drum. This dimensional expansion from one side to both sides enables parallel processing, significantly improving deposition speed while maintaining manageable apparatus complexity through modular target design.
2Loss of time
If sequential deposition on lateral portions is used, then the apparatus is simple, but the total deposition time increases
Solution Approach 1:
Both the inside source target and outside source target operate simultaneously and continuously during the deposition process. The first lateral portion receives deposition from the inside source target while the second lateral portion receives deposition from the outside source target at the same time, eliminating idle time and achieving continuous useful action on both portions, thereby reducing total deposition time and improving processing efficiency.
3Manufacturing precision
If single source target deposition is used, then the apparatus is simple, but the deposition uniformity and quality on both lateral portions deteriorates
Solution Approach 1:
Each source target is specifically optimized for its corresponding lateral portion. The inside source target is positioned and configured to provide optimal deposition uniformity for the first lateral portion, while the outside source target is independently optimized for the second lateral portion. This local quality approach ensures high deposition uniformity and quality on each portion without requiring a single complex target that would struggle to optimize for both sides simultaneously.
4Adaptability or versatility
If lateral surface wiring is not deposited, then the manufacturing process is simple, but the bezel-less substrate requirement cannot be met
Solution Approach 1:
The substrate mounting drum rotates during the deposition process, dynamically exposing different portions of the substrate lateral surfaces to the source targets. This dynamic rotation ensures uniform 3D deposition coverage on the lateral surfaces, enabling the complex bezel-less substrate wiring formation while maintaining manufacturing feasibility through automated rotational positioning rather than static complex masking processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous deposition on both lateral portions of a substrate, improving the uniformity and quality of three-dimensional deposition, reducing time, effort, and costs, while maintaining excellent electrical properties.
Implementation Method 1
at least one inside source target configured to deposit wiring onto one lateral portion of the substrate exposed protruding from an inside circumferential surface of the substrate mounting drum; and at least one outside source target configured to deposit wiring onto the other lateral portion of the substrate exposed protruding from an outside circumferential surface of the substrate mounting drum
Data Source
AI summary
Disclosed is a deposition apparatus for a substrate, in particular, a deposition apparatus for both lateral portions of a substrate, in which at least one substrate is inserted in and mounted to a revolvably disposed substrate mounting drum in a direction from an outside circumferential surface toward an inside circumferential surface, one lateral portion of the substrate exposed protruding from an inside circumferential surface is subjected to deposition based on an inside source target, and the other lateral portion of the substrate exposed protruding from an outside circumferential surface is subjected to deposition based on an outside source target, thereby depositing wiring to both lateral portions of the substrate at once, and achieving a three-dimensional (3D) deposition improved in uniformity and quality.