Dual-Sided Switch Cooling Assembly for Shorter Heat Paths
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Solution Overview
Problem
Existing semiconductor packages face inefficiencies in cooling due to temperature rise along the length of the cooling assembly, particularly in single-sided cooling configurations, and the need for encapsulation in immersion cooling systems.
Innovation Solution
The implementation of dual-sided cooling modules with a coupling heat sink that thermally couples high and low side modules, and the use of single switch modules with overlapping perimeters to reduce assembly length, along with immersion cooling designs that expose semiconductor components to coolant without encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If single-sided cooling configuration is used, then device complexity is reduced, but heat transfer efficiency deteriorates as coolant temperature rises along assembly length
Solution Approach 1:
The patent transitions from single-sided cooling to dual-sided cooling by adding cooling capability in another dimension (the opposite side of the semiconductor device). This allows coolant to flow through heat sinks on both sides of the assembly, effectively doubling the heat dissipation pathways and maintaining heat transfer efficiency without the coolant temperature rising excessively along a single long path.
Solution Approach 2:
The cooling assembly is segmented into multiple independent cooling zones with separate heat sinks on opposite sides. Each heat sink can be independently cooled by separate coolant flows, allowing the system to handle high heat loads by distributing thermal management across multiple segments rather than relying on a single long coolant path.
2Loss of energy
If module length is increased to improve cooling, then heat transfer efficiency improves, but assembly length increases
Solution Approach 1:
Instead of extending the assembly length in one direction, the patent utilizes the third dimension by implementing cooling on both sides of the semiconductor device. This allows heat dissipation to occur in opposite directions simultaneously, achieving improved heat transfer efficiency without increasing the overall assembly length.
Solution Approach 2:
The heat sinks are designed to be coupled directly to opposite sides of the semiconductor device, with coolant channels nested within the heat sink structures. This compact nesting arrangement allows extensive heat dissipation surface area to be achieved within a compact overall footprint, avoiding length increases.
3Reliability
If traditional cooling with encapsulation is used, then device protection is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The patent extracts the semiconductor device from its traditional encapsulated housing and exposes it directly to the coolant environment. By removing the encapsulation barrier, heat transfer efficiency is dramatically improved as thermal contact between the device and coolant is maximized, while the device remains protected by the controlled coolant environment and heat sink structures.
Solution Approach 2:
The patent changes the thermal parameter of the device packaging from encapsulated (insulating) to exposed (thermally conductive). By transitioning from traditional encapsulation materials to direct coolant contact, the thermal conductivity parameter is effectively increased, enabling superior heat transfer while maintaining device reliability through the controlled cooling environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by reducing assembly length and eliminating the need for encapsulation, while maintaining effective heat transfer and protection in immersion cooling systems.
Implementation Method 1
a coupling heat sink that thermally couples the high side module and low side module
Implementation Method 2
the use of folded fin heat sinks or pin structures to enhance heat transfer
Implementation Method 3
a coupling heat sink that thermally couples the high side module and low side module
Implementation Method 4
A single cooling fluid may contact the coupling heat sink, the high side heat sink, and the low side heat sink
Data Source
AI summary
Implementations of a dual sided cooling module may include a high side module coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module; a high side heat sink coupled at a second largest planar surface of the high side module; and a low side heat sink coupled at a second largest planar surface of the low side module. A single cooling fluid may contact the coupling heat sink, the high side heat sink, and the low side heat sink.