Dual-Sided Wafer Optical Processing With LED Cooling Control
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Solution Overview
Problem
Current solar cell wafer processing methods are inefficient in shortening the light attenuation and recovery period post-sintering, necessitating the development of a device that can optically process both the front and rear faces of wafers simultaneously to enhance production efficiency.
Innovation Solution
A wafer optical processing device comprising a conveyor belt with upper and lower light source modules, each with LED light sources, and cooling systems, along with transparent baffle plates and airflow management to efficiently process both faces of the wafer, ensuring effective light energy distribution and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If only one face of the wafer is optically processed after sintering, then the processing equipment is simpler, but the processing time is extended and production efficiency is reduced
Solution Approach 1:
The patent transitions from single-sided optical processing to dual-sided simultaneous processing by adding a lower light source device beneath the conveyor belt. This dimensional expansion allows light to illuminate both the upper and lower surfaces of the wafer concurrently, effectively doubling the processing capacity without requiring sequential operations, thereby resolving the contradiction between processing efficiency and equipment complexity.
Solution Approach 2:
The optical processing system is segmented into independent upper and lower light source devices, each capable of operating autonomously. The light source modules are divided into multiple independently controllable units that can be selectively activated based on processing requirements. This segmentation allows flexible operation modes (single-sided or dual-sided processing) and maintains equipment simplicity while enabling high-efficiency dual-sided processing when needed.
2Loss of time
If high intensity light sources are used to shorten processing time, then the processing speed increases, but the temperature control becomes difficult and may damage the wafer
Solution Approach 1:
The light source modules operate in periodic pulsed mode rather than continuous illumination. Each light source module can be independently controlled to emit light in timed intervals, allowing the wafer to absorb optical energy in bursts while having cooling periods in between. This periodic action enables high-intensity processing to occur in short bursts, achieving rapid processing while preventing excessive temperature accumulation that would damage the wafer.
Solution Approach 2:
The system dynamically adjusts multiple parameters including light intensity, pulse duration, and duty cycle of the light source modules based on real-time processing conditions. By changing these parameters, the system can optimize the balance between processing speed and temperature control, allowing high-intensity processing when cooling is effective and reducing intensity when temperature approaches critical levels, thus resolving the contradiction between processing time and temperature control.
3Productivity
If multiple light source modules are used to process both faces simultaneously, then the processing efficiency is greatly increased, but the energy consumption and system complexity increase
Solution Approach 1:
The light source modules are designed with dynamic control capabilities, allowing individual modules to be selectively activated or deactivated based on processing needs. The system can operate in energy-efficient single-sided mode when dual-sided processing is not required, and switch to dual-sided mode for high-priority batches. This dynamic operation mode enables the system to adapt energy consumption to actual production demands, resolving the contradiction between processing efficiency and energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables simultaneous processing of both faces of the wafer, significantly increasing processing efficiency and reducing the overall processing time to 10-30 seconds, while maintaining temperature control within a suitable range.
Implementation Method 1
said upper light source device and said lower light source device respectively comprise a plurality of light source modules, and one or more of said plurality of light source modules may be started when a wafer is optically processed; wherein said light source module provides an LED light source
Implementation Method 2
an upper cooling device, said upper cooling device being disposed above said upper light source device to cool said upper light source device, and a lower cooling device, said lower cooling device being disposed below said lower light source device to cool said lower light source device
Data Source
Figure 1~2A
Figure 2B~3
Figure 4~5
AI summary
The present application provides a wafer optical processing device and a sintering furnace, said wafer optical processing device comprising: a wafer support device (140a, 140b), an upper light source device (402), and a lower light source device (502). Said wafer support device is provided with a support piece (305), said support piece being configured to be capable of supporting said wafer above said upper surface; said upper light source device is disposed above said wafer support device and is configured to provide a light source that illuminates the upper surface of said support piece; said lower light source device is disposed below said wafer support device and is configured to provide a light source that illuminates a lower surface of said support piece. A wafer optical processing device provided by the present application is capable of processing a wafer efficiently.