Dual-SIM Interface Sharing Through a Single Modem Circuit
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Solution Overview
Problem
Current wireless communication devices with multiple subscriber identification modules face increased complexity and cost due to the integration of multiple circuits and interfaces, which complicates network switching and SIM profile management.
Innovation Solution
An electronic device design where two subscriber identification modules share a single modulator-demodulator circuit with standardized ISO 7816 communication interfaces, allowing data exchange through a multiplexer or embedded universal integrated circuit cards, reducing the need for multiple communication interfaces and simplifying SIM profile management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple subscriber identification modules are integrated into a wireless communication device, then the device can access extended wireless communication functionalities and switch between different networks, but the complexity and cost of the device increases
Solution Approach 1:
The patent merges multiple subscriber identification modules (SIMs) into a single integrated circuit chip, allowing multiple SIM profiles to coexist and be managed within one physical component. This consolidation enables the device to access multiple wireless networks and communication functionalities while reducing the overall device complexity by eliminating the need for separate circuit boards, slots, and interfaces for each SIM card.
Solution Approach 2:
The integrated circuit chip is designed to universally support multiple SIM profiles and different wireless communication standards simultaneously. This multi-functional design allows a single component to perform the roles of multiple traditional SIM cards, enabling network switching and extended communication capabilities without requiring separate dedicated hardware for each function.
2Adaptability or versatility
If multiple subscriber identification modules are integrated into a wireless communication device, then the device can access extended wireless communication functionalities, but the cost of the device increases
Solution Approach 1:
By combining multiple SIM functionalities into a single integrated circuit chip, the patent reduces manufacturing costs associated with multiple separate components, assembly operations, and testing procedures. The consolidated design requires fewer manufacturing steps and less material, directly lowering production costs while maintaining extended wireless communication capabilities.
3Reliability
If multiple communication interfaces are provided for multiple subscriber identification modules, then each SIM can operate independently, but the device size and complexity increase
Solution Approach 1:
The patent merges multiple communication interfaces into a single shared interface within the integrated circuit chip. This allows multiple SIM profiles to operate independently through time-division multiplexing or other switching mechanisms, maintaining reliable independent operation while occupying minimal physical space within the chip architecture, thereby reducing overall device size.
Data Source
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AI summary
This description relates to an electronic device (600) comprising: a modulator-demodulator circuit (601); a first integrated circuit (603) implementing a first subscriber identification module; and at least a second integrated circuit (207) for implementing a second subscriber identification module, in which a data transmit-receive terminal (215) of the first circuit and a data transmit-receive terminal (215) of the second circuit are connected to the same data transmit-receive terminal (215) of the modulator-demodulator circuit.