Dual SoC Eyewear for Simultaneous USB Communication
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Solution Overview
Problem
Current system on a chip (SoC) technologies face challenges in enabling simultaneous universal serial bus (USB) communications with multiple devices, particularly in eyewear devices, which require efficient communication protocols to manage diverse components like cameras, sensors, and modems, leading to complexity and potential bottlenecks in data transfer.
Innovation Solution
The implementation of a dual SoC configuration with separate USB sub-connection interfaces allows for simultaneous communication with multiple devices through a single USB interface, distributing processing workload and thermal management across two SoCs positioned on opposite sides of the eyewear device, enabling efficient data exchange and reduced interconnect complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single SoC is used to manage multiple USB devices, then device complexity is reduced, but communication bottlenecks and processing overload occur
Solution Approach 1:
The patent divides the single SoC into two separate SoCs (first SoC and second SoC), each handling specific USB communication tasks. The first SoC manages communications with first USB devices while the second SoC manages communications with second USB devices, thereby segmenting the processing workload and eliminating communication bottlenecks while maintaining manageable system complexity through clear functional division
2Ease of manufacture
If a single SoC handles all USB communications, then manufacturing is simpler, but thermal management becomes difficult
Solution Approach 1:
The patent segments the thermal load by creating two separate SoCs that physically distribute heat generation across different locations in the eyewear device. Each SoC handles a portion of the USB communication processing, dividing the thermal burden and improving heat dissipation while maintaining manufacturing feasibility through modular assembly
Solution Approach 2:
The patent transitions from a single-point thermal management problem to a distributed thermal management solution by placing SoCs at different spatial locations within the device. This dimensional distribution of processing units naturally disperses thermal load across multiple zones, enabling more effective heat management while preserving manufacturing simplicity
3Adaptability or versatility
If multiple USB interfaces are implemented separately, then communication capability is improved, but device complexity increases
Solution Approach 1:
The patent implements USB controller circuits within the SoCs that can universally handle multiple USB device types and communication modes. The first and second USB controller circuits are designed to manage various USB devices (cameras, sensors, modems, displays) through standardized protocols, providing versatile communication capability while maintaining internal complexity management through unified controller architecture
Data Source
AI summary
Eyewear including a frame having a first side and a second side, a first temple extending from the first side of the frame, a second temple extending from the second side of the frame, electronic components, a first system on a chip (SoC) adjacent the first side of the frame coupled to a first set of the electronic components, and a second system on a chip adjacent the second side, the second SoC coupled to the first SoC and to a second set of the plurality of electronic components. Processing workloads are balanced between the first SoC and the second SoC by performing a first set of operations with the first SoC and performing a second set of operations with the second SoC.