Dual Spin Chuck Substrate Cleaning Mechanism
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in evenly cleaning the entire lower surface of substrates due to positional deviations caused by high pressure from cleaning brushes, which interferes with chuck pins, leading to incomplete cleaning.
Innovation Solution
A substrate processing apparatus with dual holding and cleaning mechanisms, including a suction holder for central substrate fixation and rotating brushes for peripheral cleaning, ensures even cleaning without interference, utilizing separate brushes and cleaning liquids to prevent re-adherence and maintain cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high pressure is supplied from the brush to the substrate in the partial region, then cleaning effectiveness is improved, but positional deviation of the substrate occurs due to chuck pins being in the open state
Solution Approach 1:
The substrate holding function is divided between two independent devices: the first substrate holding device with a suction holder for stable center positioning, and the second substrate holding device with chuck pins for peripheral support. This segmentation allows the suction holder to maintain positioning accuracy while the chuck pins can be in the open state during brush cleaning, eliminating the conflict between cleaning pressure and positioning stability.
Solution Approach 2:
The suction holder acts as an intermediary that provides stable substrate positioning during the cleaning process. By using the suction holder to hold the substrate at the center while the brush cleans the peripheral portion, the system mediates between the need for high cleaning pressure and the need for stable positioning, allowing both requirements to be satisfied simultaneously.
2Ease of operation
If the chuck pins are switched to the open state in the partial region, then the brush can clean the outer peripheral end, but the substrate experiences positional deviation
Solution Approach 1:
The substrate holding function is divided between two independent devices: the first substrate holding device with a suction holder for stable center positioning, and the second substrate holding device with chuck pins for peripheral support. This segmentation allows the suction holder to maintain positioning accuracy while the chuck pins can be in the open state during brush cleaning, eliminating the conflict between cleaning pressure and positioning stability.
3Device complexity
If a single substrate holding device is used, then device complexity is reduced, but it is difficult to prevent interference between the holding mechanism and cleaning brush
Solution Approach 1:
The substrate holding function is divided between two independent devices: the first substrate holding device with a suction holder for stable center positioning, and the second substrate holding device with chuck pins for peripheral support. This segmentation allows the suction holder to maintain positioning accuracy while the chuck pins can be in the open state during brush cleaning, eliminating the conflict between cleaning pressure and positioning stability.
Solution Approach 2:
The cleaning operation is moved to a different spatial dimension by using the peripheral portion of the substrate that is rotated while being held by the suction holder. The brush cleans the outer peripheral end in a region that is spaced apart from the center holding position, allowing both holding and cleaning to occur simultaneously without interference in the same spatial zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves even cleaning of the entire substrate surface by spacing holding and cleaning positions, preventing positional deviations and re-adherence, thus improving substrate cleanliness and reducing brush contamination.
Implementation Method 1
a suction holder that is configured to be rotatable about a vertical axis and sucks a center portion of the lower surface of the substrate
Implementation Method 2
a first brush that cleans a peripheral portion of the lower surface of the substrate that is rotated while being held by the suction holder
Implementation Method 3
a second brush that cleans a region inward of the peripheral portion of the lower surface of the substrate that is rotated while being held by the abutment holder
Data Source
AI summary
An upper spin chuck and a lower spin chuck are arranged in a vertical direction. In the lower spin chuck, a substrate holder sucks a center portion of a lower surface of a substrate, so that the substrate is held. In this state, a peripheral portion of the lower surface of the substrate rotated by a spin motor is cleaned by a brush of a first back surface cleaning mechanism. In the upper spin chuck, a plurality of chuck pins abut against an outer peripheral end of the substrate, so that the substrate is held. In this state, a region inward of the peripheral portion of the lower surface of the substrate rotated by the spin motor is cleaned by a brush of a second back surface cleaning mechanism. Receiving and transferring of the substrate are performed by a receiving transferring mechanism between the upper and the lower spin chucks.