Dual Spiral Cooling Apparatus for Electrical Substrates
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Solution Overview
Problem
Existing cooling technologies for electrical substrates are inefficient in dissipating heat from electrical components, as they rely on conventional heat sinks and heat exchangers that do not effectively manage heat transfer across the substrate surfaces.
Innovation Solution
A cooling apparatus featuring dual spiral fluid paths with flow diverters and thermally-conductive structures that facilitate heat transfer by circulating a coolant through a system of interconnected fluid paths and spacers, ensuring efficient heat absorption and dissipation from both sides of the electrical substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat sinks and heat exchangers are used to cool electrical substrates, then the cooling structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The cooling apparatus is divided into multiple functional components: a support structure with terminals, a first outer portion with a first spiral fluid path, a second outer portion with a second spiral fluid path, and an intermediate portion with apertures. Each segment performs a specific function in the heat dissipation process, allowing the system to achieve high efficiency while maintaining modularity and manageable complexity.
Solution Approach 2:
The patent employs spiral fluid paths in both the first and second outer portions to divert and circulate coolant. The curved spiral configuration enhances heat transfer efficiency by increasing the contact time and surface area between the coolant and the electrical substrates, thereby improving heat dissipation performance without requiring a proportionally larger system.
2Reliability
If dual spiral fluid paths with flow diverters are implemented, then heat transfer efficiency is enhanced, but the device complexity increases
Solution Approach 1:
The first and second spiral fluid paths are integrated into a unified cooling apparatus with a common support structure and interconnected through apertures in the intermediate portion. This merging approach allows the dual-path system to achieve superior heat transfer efficiency while sharing common structural elements, thereby reducing the overall complexity increase compared to completely separate cooling systems.
Solution Approach 2:
The intermediate portion serves multiple functions: it structurally connects the first and second outer portions, provides apertures for fluid communication between the two spiral paths, and supports the overall mechanical assembly. This multi-functionality reduces the need for additional dedicated components, balancing the enhanced heat transfer capability with controlled device complexity.
3Temperature
If thermally-conductive structures and spacers are added to facilitate heat transfer, then heat absorption and dissipation are improved, but manufacturing complexity increases
Solution Approach 1:
The cooling apparatus employs a nested structural arrangement where the first and second electrical substrates are positioned within the framework formed by the outer portions and intermediate portion. The spacers and thermally-conductive structures are integrated into this nested configuration, allowing heat transfer enhancement while maintaining a compact assembly that simplifies manufacturing and assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively dissipates heat from electrical substrates by utilizing a dual spiral fluid path design with flow diverters and thermally-conductive materials, enhancing heat transfer efficiency and maintaining the coolant's temperature, thus improving overall thermal management.
Implementation Method 1
thermally-conductive structures that facilitate heat transfer by circulating a coolant through a system of interconnected fluid paths
Implementation Method 2
dual spiral fluid paths with flow diverters that facilitate heat transfer by circulating a coolant
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.