Dual-Spot Laser Dicing for Faster Substrate Cutting
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Solution Overview
Problem
The Grinding After Laser (GAL) process for substrate dicing faces limitations in increasing processing speed, necessitating a reduction in the number of scans to improve productivity.
Innovation Solution
A laser processing apparatus that includes a stage for supporting the substrate, a laser light source, a mode converter to convert the laser beam into a cylindrical vector beam, and a polarizing filter to form a double-o shaped beam, which is then condensed into first and second laser beams. These beams are scanned along cutting lines on the substrate, allowing for simultaneous scanning and adjustment of beam spacing based on die size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of scans is reduced to improve productivity, then processing speed increases, but manufacturing precision may deteriorate
Solution Approach 1:
The patent divides a single laser beam into multiple beams (first laser beam and second laser beam) using a beam dividing unit. This segmentation allows simultaneous processing along multiple cutting lines, effectively increasing productivity without sacrificing precision, as each beam maintains its focusing capability while working in parallel
Solution Approach 2:
The patent combines multiple cutting operations into a single processing pass by using multiple laser beams simultaneously. The beam combining unit merges the first and second laser beams to process different cutting lines at the same time, achieving both high productivity and maintained precision through coordinated multi-beam operation
2Productivity
If multiple laser beams are used to increase productivity, then processing speed improves, but device complexity increases
Solution Approach 1:
The patent employs optical components with multi-functional capabilities. The beam dividing unit, beam combining unit, and focusing lens work together to perform multiple functions (beam splitting, recombination, and focusing) using integrated optical elements, thereby increasing productivity without proportionally increasing overall system complexity
Solution Approach 2:
The patent implements a nested optical system where the beam dividing and combining units are integrated within the existing optical path. The first and second laser beams share common optical components such as the focusing lens and scanning mechanism, allowing multiple beams to be generated and controlled without requiring separate complete optical systems for each beam
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables simultaneous scanning of first and second laser beams along cutting lines on the substrate, improving productivity without increasing the size of the optical system, and allowing for easy optical adjustment of beam spacing.
Implementation Method 1
a mode converter configured to convert the laser beam into a cylindrical vector beam
Implementation Method 2
a polarizing filter configured to polarize the cylindrical vector beam to form a double-o shaped beam
Implementation Method 3
a condensing lens configured to condense the double-o shaped beam into first and second laser beams at first and second spots apart in the first horizontal direction on the substrate
Data Source
AI summary
A laser processing apparatus includes a stage configured to support a substrate to be processed, a laser light source configured to generate a laser beam, a mode converter configured to convert the laser beam into a cylindrical vector beam, a polarizing filter configured to polarize the cylindrical vector beam to form a double-o shaped beam in which two beams are arranged adjacent to each other in a first horizontal direction, a condensing lens configured to condense the double-o shaped beam into first and second laser beams at first and second spots apart in the first horizontal direction on the substrate, and a driving portion configured to move the first and second laser beams relatively with respect to the substrate in a second horizontal direction different from the first horizontal direction.