Semiconductor Package Layout With Thermally Isolated Dual Heat Spreaders
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Solution Overview
Problem
Conventional semiconductor packages face inadequate heat dissipation due to heat transfer between integrated electronic components, which can harm performance in compact designs.
Innovation Solution
A semiconductor package design featuring a primary semiconductor die with a top surface divided into regions, where an auxiliary semiconductor die is attached to one region and a primary heat spreader assembly is thermally isolated from an auxiliary heat spreader assembly attached to the other region, allowing for independent heat dissipation of each die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common heat spreader is used for overall heat dissipation, then the heat dissipation structure is simple, but heat generated from one electronic component is transferred to other electronic components undesirably
Solution Approach 1:
The heat dissipation structure is divided into separate heat spreaders for each electronic component. Each heat spreader is dedicated to a specific component, preventing heat transfer between components while maintaining structural functionality. This segmentation resolves the contradiction by increasing structural complexity slightly to eliminate harmful heat transfer.
2Volume of moving object
If electronic components are tightly integrated to reduce device size, then the device becomes more compact, but heat dissipation becomes inadequate due to heat transfer between components
Solution Approach 1:
Separate heat spreaders are assigned to each electronic component, allowing independent heat dissipation paths. This enables tight integration of components in a compact device while preventing harmful heat transfer between them, thus resolving the contradiction between device compactness and heat dissipation effectiveness.
3Temperature
If separate heat spreaders are used for each electronic component, then heat dissipation is improved, but the heat dissipation structure becomes more complex
Solution Approach 1:
The patent implements separate heat spreaders for each component, accepting increased structural complexity as necessary to achieve effective heat dissipation and prevent harmful heat transfer between components.
Solution Approach 2:
Each heat spreader is locally optimized for its specific component's thermal characteristics, allowing tailored heat dissipation solutions that improve overall thermal management while maintaining reasonable structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes heat transfer between components, enhancing heat dissipation and maintaining performance in tight layouts by using discrete heat spreader assemblies for each die, thereby optimizing thermal management.
Implementation Method 1
the primary heat spreader assembly is thermally isolated from the auxiliary heat spreader assembly
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a primary semiconductor die with a top surface, wherein the top surface comprising a first region and a second region besides the first region; an auxiliary semiconductor die attached on the first region of the top surface of the primary semiconductor die; a primary heat spreader assembly attached on the second region of the top surface of the primary semiconductor die; and an auxiliary heat spreader assembly attached on a top surface of the auxiliary semiconductor die, wherein the primary heat spreader assembly is thermally isolated from the auxiliary heat spreader assembly.