Dual-Stack Electrostatic Clamps for EUV Reticle Temperature Control
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Solution Overview
Problem
Current electrostatic clamps for EUV lithography systems face challenges in providing reliable and cost-effective solutions for holding reticles and substrates, particularly due to the need for frequent changes and the requirement of temperature regulation to prevent deformation caused by EUV radiation.
Innovation Solution
The development of electrostatic clamps with dual stacks, each comprising a clamp body, electrodes, a dielectric plate, and channels for thermally conditioned liquids or gases, joined through optical contact bonding or electrical forces, to provide secure and temperature-controlled retention of reticles and substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vacuum chucking is used to hold reticles and substrates in EUV lithography systems, then the clamping mechanism is simple, but it cannot maintain reliable holding under vacuum conditions and temperature variations
Solution Approach 1:
The patent replaces traditional mechanical vacuum chucking systems with an electrostatic clamping mechanism. The electrostatic clamp uses electric fields generated by electrodes to hold reticles and substrates, eliminating the need for complex mechanical vacuum sealing components while maintaining reliable holding under vacuum conditions. This substitution of mechanical systems with electrostatic fields directly resolves the contradiction between reliability and structural complexity.
2Adaptability or versatility
If frequent reticle and wafer changes are implemented to support multiple lithography levels, then manufacturing flexibility is improved, but production time and operational complexity increase
Solution Approach 1:
The electrostatic clamp enables dynamic and rapid adjustment of clamping forces through electrical control, allowing quick release and reattachment of different reticles and wafers. The ability to independently control multiple electrodes facilitates fast tooling changes without mechanical intervention, directly reducing cycle time while maintaining adaptability for multiple lithography levels.
Solution Approach 2:
The system changes operational parameters (electrical voltage to the electrodes) to achieve rapid tooling changes. By adjusting the electrical field strength, the clamp can quickly release or secure different substrates, enabling frequent reticle and wafer changes without manual intervention, thus reducing loss of time while maintaining versatility.
3Stability of the object's composition
If temperature regulation is added to prevent EUV radiation-induced deformation, then dimensional stability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the temperature regulation function directly into the electrostatic clamp structure by integrating cooling channels within the clamp body. This combination eliminates the need for separate external cooling systems, reducing overall device complexity while maintaining dimensional stability through active temperature control of the held substrates.
Solution Approach 2:
The electrostatic clamp serves multiple functions simultaneously: it provides electrostatic holding, temperature regulation through integrated cooling channels, and structural support. This multi-functionality reduces the need for separate dedicated components, thereby reducing device complexity while achieving dimensional stability through active thermal management.
4Temperature
If dual-stack electrostatic clamps with independent temperature control are used, then temperature regulation effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The dual-stack design segments the clamp into two independent stacks, each with its own cooling channels and temperature control capability. This segmentation allows for modular manufacturing where each stack can be produced and tested independently, then assembled together. The modular approach reduces overall manufacturing complexity compared to a monolithic design with integrated temperature control for the entire clamp.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-stack electrostatic clamps enable fast and easy wafer/reticle changes, improve cycle time, and reduce manufacturing costs by allowing parallel manufacturing and efficient temperature regulation, thereby enhancing the stability and productivity of EUV lithography processes.
Implementation Method 1
electrostatic clamps are used instead of traditional vacuum chucking
Implementation Method 2
a coolant may be circulated through the electrostatic clamp
Implementation Method 3
a coolant may be circulated through the electrostatic clamp
Implementation Method 4
the first and second stacks are joined by an optical contact bonding
Data Source
AI summary
An electrostatic clamp and a method for fabricating the same. The electrostatic clamp includes a first stack and a second stack, wherein the first stack is joined with the second stack. Each of the first and second stacks includes a clamp body, one or more electrodes disposed on the clamp body, a dielectric plate disposed on the electrodes, and a plurality of channels inside the clamp body.