Dual-Stage Cooling System Assembly for High-Power Integrated Circuits
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Solution Overview
Problem
Existing air-cooling systems for electronic devices face challenges in increasing thermal conductivity, which affects the reliability and performance of electronic devices due to ineffective heat dissipation.
Innovation Solution
A cooling system assembly that includes a water block unit with a fin stack and heat pipes, thermally coupled to a liquid cooling unit with a liquid plate heat exchanger, enhancing heat transfer and dissipation through phase-change and convection mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air-cooling systems use conventional attachment members (screws, push pins) with thermal pads or paste, then the system is easy to manufacture and assemble, but thermal conductivity is limited and heat dissipation effectiveness is reduced
Solution Approach 1:
The patent merges the water block unit and liquid cooling unit into an integrated assembly where the water block is directly coupled to the liquid cooling unit. This integration eliminates the need for separate attachment members and thermal interfaces between these components, thereby improving thermal conductivity while maintaining manufacturing simplicity.
Solution Approach 2:
The patent introduces a thermal interface material positioned between the water block and the packaged integrated circuit as an intermediary that enhances thermal conduction. This mediator improves heat transfer effectiveness without requiring complex mechanical attachment systems.
2Reliability
If air-cooling systems increase thermal conductivity through better materials and interfaces, then heat dissipation improves, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The water block unit and liquid cooling unit are designed as pre-integrated components that function as a unified assembly. This merging reduces the number of separate manufacturing steps and assembly operations required, while achieving high thermal conductivity through the direct coupling design.
Solution Approach 2:
The water block unit is pre-assembled with the liquid cooling unit and thermal interface materials before installation. This preliminary assembly ensures optimal thermal contact and alignment, simplifying the final installation process while maintaining high thermal conductivity performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed cooling system assembly achieves higher thermal conductivity, effectively transporting heat away from electronic components, thereby improving the reliability and performance of electronic devices by enhancing heat dissipation.
Implementation Method 1
The water block unit is configured for phase-change of a first cooling fluid
Implementation Method 2
The liquid cooling unit is configured to be flow through by a second cooling fluid
Implementation Method 3
Each plurality of heat pipes is respectively coupled to the water block on one end and each plurality of heat pipes is respectively coupled to the fin stack on an other end
Implementation Method 4
the fan unit configured to force air across the fin stack
Implementation Method 5
a liquid plate heat exchanger comprising a liquid cooling water block
Data Source
AI summary
A cooling system assembly may include a water block unit and liquid cooling unit. The water block unit is configured for phase-change of a first cooling fluid and the liquid cooling unit is configured to be flow through by a second cooling fluid. The water block unit includes a first thermal transfer surface and second thermal transfer surface. The first thermal transfer surface is configured to couple to a packaged integrated circuit. The liquid cooling unit includes a liquid plate heat exchanger comprising a liquid cooling water block coupled to the second thermal transfer surface. The first thermal transfer surface is thermally coupled to the packaged integrated circuit, whereby the water block unit transports heat away from the packaged integrated circuit. The liquid cooling water block is thermally coupled to the second thermal transfer surface, whereby the liquid cooling unit transports heat away from the water block unit.