Dual-Stamp Substrate Machining for Secure Document Insertion

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Solution Overview

Problem

Existing methods for processing substrates to insert filling materials into openings lack stability and precision in creating a mechanical connection between the substrate and the filling material, particularly in the production of value and security documents.

Innovation Solution

A device comprising two stamps, one for cutting out an opening in the substrate and another for cutting out a corresponding element from a filling material, which is then inserted into the opening, ensuring a stable mechanical connection through mirror-inverted geometry and controlled movement trajectories, with a carrier device and clamping system for precise positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single stamp is used to cut both the opening and the filling material element, then the device complexity is reduced, but the manufacturing precision and stability of the mechanical connection deteriorate

Engineering Contradiction:
Improvedevice complexityVSAvoidmanufacturing precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The single stamp is divided into two separate stamps: a first stamp for cutting the opening in the substrate and a second stamp for cutting the filling material element. This segmentation allows each stamp to be optimized for its specific function, improving the precision of both the opening and the filling material element while maintaining controlled complexity through dedicated functional components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first stamp acts as an intermediary by creating the opening in the substrate that receives the filling material element. This intermediate structure enables precise positioning and stable mechanical connection, as the opening geometry is specifically designed to accommodate the filling material element cut by the second stamp.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the substrate is not fixed during processing, then the ease of operation is improved, but the manufacturing precision and stability of the mechanical connection deteriorate

Engineering Contradiction:
Improveease of operationVSAvoidmanufacturing precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The substrate is fixed to the carrier device before the stamping operations begin. This preliminary fixation ensures that the substrate remains stationary during the cutting of the opening and the subsequent insertion of the filling material element, thereby maintaining high manufacturing precision without complicating the operation sequence.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If the filling material element is inserted without a precise geometric match, then the ease of manufacture is improved, but the strength and stability of the mechanical connection deteriorate

Engineering Contradiction:
Improveease of manufactureVSAvoidstrength
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The first stamp and second stamp are designed with mirror-inverted geometries relative to each other. The first stamp creates an opening with a specific asymmetric shape, while the second stamp cuts a filling material element with the corresponding mirror-inverted asymmetric shape. This asymmetric design ensures a precise geometric match between the opening and the filling material element, maximizing the strength and stability of the mechanical connection while maintaining ease of manufacture through standardized stamp designs.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentEP3414105B1Apparatus and method for machining a substrate
Publication Date: 2021.03.03 BUNDESDRUCKEREI GMBH
  • EP3414105B1 patent drawingFigure 1
  • EP3414105B1 patent drawingFigure 2
  • EP3414105B1 patent drawingFigure 3

AI summary

The invention relates to a method and an apparatus (1) for machining a substrate (3), wherein the apparatus (1) comprises a carrier device for the substrate (3), wherein the apparatus (1) comprises a first punch (17), wherein the first punch (17) is movable relative to the substrate (3) such that, by way of the first punch (17), an element (23) is able to be cut out of the substrate (3), wherein the apparatus (1) comprises a provision device for a filling material (12), wherein the apparatus (1) comprises at least one further punch (20), wherein the further punch (20) is movable relative to the filling material (12) such that, by way of the further punch (20), an element (26) is able to be cut out of the filling material (12), wherein the first punch (17) is movable relative to the substrate (3) such that, by way of the first punch (17), the element (26) cut out of the filling material (12) is arrangeable in an opening (25) in the substrate (3).