Dual Stiffener Semiconductor Package for Thermal and Mechanical Stability
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Solution Overview
Problem
Conventional semiconductor packages face challenges with increasing power consumption, thermal management, and manufacturing costs due to thick core layers, numerous wiring layers, and large via sizes, which affect mechanical stability and thermal response.
Innovation Solution
The implementation of a semiconductor package design featuring dual stiffeners, including an upper and lower stiffener with rectangular cross-sections, surrounding the package substrates, and a heat sink for improved mechanical stability and thermal characteristics, along with thin core layers and reduced wiring layers to enhance power/signal integrity and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick core layers and numerous wiring layers are used in conventional semiconductor packages, then manufacturing robustness is improved, but manufacturing cost increases and power consumption increases
Solution Approach 1:
The patent changes the physical parameters of the package structure by reducing core layer thickness from conventional thick layers to thin layers (e.g., 10-50 micrometers), reducing the number of wiring layers, and decreasing via sizes. These parameter changes maintain manufacturing robustness while reducing material usage and manufacturing complexity, thereby lowering costs
Solution Approach 2:
The patent segments the package structure into distinct functional layers with thin core layers separated by stiffeners. This segmentation allows each layer to be optimized independently, reducing the need for thick continuous core layers while maintaining structural integrity and manufacturing robustness
2Ease of manufacture
If conventional package structures are used, then manufacturing simplicity is maintained, but mechanical stability deteriorates
Solution Approach 1:
The patent introduces stiffeners as separate structural elements that segment the package substrate into rigid zones. These stiffeners are positioned at critical locations to provide mechanical support, improving stability without requiring complex manufacturing processes throughout the entire package structure
Solution Approach 2:
The patent applies local quality enhancement by placing stiffeners only at specific locations where mechanical support is needed, rather than making the entire package structure thick and robust. This localized reinforcement maintains manufacturing simplicity while improving mechanical stability where required
3Device complexity
If conventional package structures are used, then structural simplicity is maintained, but thermal response deteriorates
Solution Approach 1:
The patent segments the package structure into thin core layers separated by stiffeners, creating a layered configuration that reduces thermal mass and improves heat dissipation. This segmented structure maintains structural simplicity while enabling faster thermal response compared to thick conventional packages
Solution Approach 2:
The patent changes the thermal parameters by reducing core layer thickness and optimizing the stiffener configuration, which reduces thermal resistance and improves heat transfer from the semiconductor device. These parameter changes enhance thermal response without significantly increasing structural complexity
4Reliability
If thick core layers are used, then manufacturing robustness is improved, but power consumption increases
Solution Approach 1:
The patent reduces power consumption by changing the parameter of core layer thickness to thin layers, which reduces the volume of lossy dielectric materials and parasitic capacitances. This parameter change maintains manufacturing robustness through optimized thin-layer fabrication processes while significantly reducing power consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances mechanical stability, thermal response, and power/signal integrity while reducing manufacturing costs by using dual stiffeners and thin core layers, addressing the limitations of conventional semiconductor packages.
Implementation Method 1
a heat sink disposed on the upper package
Implementation Method 2
a heat sink disposed on the upper package
Data Source
AI summary
A semiconductor package includes; a dual stiffener including an upper stiffener and a lower stiffener, an upper package including an upper package substrate, a semiconductor chip centrally mounted on an upper surface of the upper package substrate, and the upper stiffener disposed along an outer edge of the upper package substrate, and a lower package substrate that centrally mounts the upper package and includes the lower stiffener disposed on an upper surface of the lower package substrate to surround the upper package substrate.