Dual-Substrate Circuit Device with Molded Thermal Housing
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Solution Overview
Problem
Existing circuit devices with embedded substrates face challenges in integrating multiple substrates efficiently, protecting electronic components, dissipating heat, and ensuring electrical connectivity while maintaining a compact design.
Innovation Solution
A circuit device design featuring two substrates embedded in a molded housing with a baseplate, where the substrates are electrically connected via flexible elements and encapsulated in a thermally conductive polymer housing, allowing for heat dissipation and external electrical contact through a conductive element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple substrates are integrated in a common mold housing, then space utilization is improved and device compactness is achieved, but heat dissipation becomes more difficult due to confined space
Solution Approach 1:
A thermally conductive adhesive layer is introduced as an intermediary between the substrates and heat dissipation structures. This adhesive layer has high thermal conductivity to efficiently transfer heat from the substrates to the mold housing or dedicated heat dissipation elements, resolving the contradiction by enabling effective heat transfer within the compact enclosed space.
Solution Approach 2:
The mold housing is designed as a composite structure incorporating thermally conductive materials and integrated heat dissipation features. This allows the housing to simultaneously provide mechanical protection and efficient thermal management, enabling compact multi-substrate integration without compromising heat dissipation performance.
2Reliability
If substrates are embedded in a molded housing for protection, then component protection is improved, but electrical connectivity and heat dissipation are restricted
Solution Approach 1:
The mold housing is designed to perform multiple functions simultaneously: mechanical protection of substrates, thermal management through integrated heat dissipation pathways, and electrical connectivity through integrated contact elements. This multi-functionality eliminates the need for separate protective housings and connection structures, simplifying the overall device while maintaining reliability.
Solution Approach 2:
The housing structure is merged with heat dissipation features and electrical contact elements into a single integrated component. This combining of protection, thermal management, and electrical connection functions into one molded piece reduces device complexity while ensuring reliable substrate protection and connectivity.
3Volume of moving object
If a compact design with embedded substrates is used, then space-saving is achieved, but manufacturing complexity increases
Solution Approach 1:
Substrates are pre-positioned and fixed to the base plate before the molding process. This preliminary arrangement ensures precise substrate placement and orientation, simplifying the subsequent molding operation and enabling automated manufacturing while achieving compact integrated designs.
Solution Approach 2:
The manufacturing process merges substrate assembly with the molding operation itself. By fixing substrates to the base plate prior to molding and using the mold to simultaneously encapsulate and connect components, the process reduces the number of separate manufacturing steps while achieving compact integration, thereby improving ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively integrates multiple substrates, protects electronic components, dissipates heat efficiently, and enables compact, space-saving configurations with reliable electrical connectivity, suitable for various applications including microelectronic and power electronics modules.
Implementation Method 1
allowing heat generated by electronic components arranged on or in the substrates to be dissipated through the mold housing
Data Source
Figure 1~2
Figure 3~4
Figure 5~7
AI summary
The invention relates to a circuit device (1) comprising a baseplate (2), a first substrate (3) arranged on a first outer side (6) of the baseplate (2), a second substrate (4) arranged on a second outer side (7) - opposite the first outer side (6) - of the baseplate (2), at least one electrical connection element (5) that electrically connects the first substrate (3) and the second substrate (4), at least one electronic component (9) arranged on or in the first substrate (3), at least one electronic component (9) arranged on or in the second substrate (4), a mould package (11) moulded around the two substrates (3, 4) and the electronic components (9) arranged thereon, and at least one contacting element (13) for electrically contacting the first substrate (3) and/or second substrate (4), said at least one contacting element being electrically conductively connected to the first substrate (3) and/or the second substrate (4) and being led out from the mould package (11).