Dual-Substrate Display Device Thermal Management
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Solution Overview
Problem
Existing organic light emitting display devices face challenges in minimizing the heat effect from the substrate on the display panel, which affects image quality and increases production costs due to the need for additional assembly components.
Innovation Solution
The display device incorporates a housing with a heat sink and a dual-substrate structure, where the second substrate is more spaced apart from the display panel than the first substrate, and a flexible film connects the substrates, enhancing heat dissipation and assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a separate member is used to reduce the heat effect on the display panel, then the heat effect is minimized, but the number of assembly man-hours increases and productivity decreases
Solution Approach 1:
The housing structure integrates the heat dissipation function directly into its design. The housing includes a heat dissipation groove that forms part of the housing body itself, eliminating the need for separate heat reduction members. This merging of functions reduces assembly complexity and productivity while effectively managing heat from the substrate to the display panel.
Solution Approach 2:
The housing serves multiple functions simultaneously: it provides structural support, protection, and heat dissipation. By incorporating the heat dissipation groove into the housing body, the same component performs both mechanical support and thermal management functions, reducing the total number of parts and assembly steps required.
2Temperature
If the second substrate is disposed more spaced apart from the display panel, then heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The substrate is divided into two separate substrates (first substrate and second substrate) with distinct functions. The first substrate is positioned closer to the display panel for electrical connection, while the second substrate is positioned farther away for heat dissipation. This segmentation allows each substrate to be optimized for its specific function while working together as an integrated system.
Solution Approach 2:
The patent utilizes the thickness dimension (Z-axis) to create spatial separation between the first and second substrates. By stacking the substrates at different distances from the display panel in the thickness direction, the design achieves heat dissipation without increasing the planar footprint or lateral complexity of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes the heat effect on the display panel, improves heat dissipation, and enhances assembly and fixing performance, leading to improved display quality and reduced production costs.
Implementation Method 1
the housing includes a heat sink disposed in the housing body
Implementation Method 2
heat dissipation performance of a substrate
Implementation Method 3
heat dissipation performance
Implementation Method 4
minimize the transfer of heat generated from the substrate to the display panel through the housing
Data Source
AI summary
An embodiment of the present specification discloses a display devices comprising: a housing with an opening formed on one side thereof; a display panel disposed in the opening; a first substrate disposed on the rear surface of the display panel; a first flexible film connecting the display panel and the first substrate; a second substrate disposed to be spaced apart from the first substrate; and a second flexible film connecting the first substrate and the second substrate, wherein the second substrate is more spaced apart from the display panel than the first substrate.