Dual-Substrate Display Panel Bezel Elimination

The patent applies dimensionality change by moving the second portion of the driving circuit to the back surface of the substrate, utilizing the z-dimension (thickness direction) to resolve the spatial conflict. This allows connections to be made through the substrate thickness rather than requiring additional lateral space, thereby reducing bezel area while maintaining connection reliability.

The patent implements nesting by placing the projection region of the second portion within the projection region of the first portion. The driving circuit portions are nested in the vertical projection, allowing compact integration of connection regions without expanding the horizontal footprint, thus reducing bezel size while preserving electrical connection functionality.

The patent applies segmentation by dividing the driving circuit into two distinct portions: the first portion on the front surface and the second portion on the back surface. This segmentation allows each portion to be manufactured and positioned independently, then integrated through alignment terminals, reducing overall manufacturing complexity compared to attempting to route all connections on a single surface.

The patent introduces alignment terminals as intermediary structures that facilitate the integration of the two driving circuit portions on opposite surfaces. These terminals serve as mediators for precise alignment and connection, simplifying the manufacturing process by providing standardized interfaces rather than requiring complex custom alignment procedures.

The patent applies preliminary action by pre-forming alignment terminals on both the first and second substrates before bonding them together. These alignment terminals are created in advance with precise geometries (protrusions and grooves) that guide the positioning process, reducing the actual alignment precision requirements during the bonding step by having pre-established reference features.

The patent employs asymmetry in the alignment terminal design, with protrusions on one substrate and corresponding grooves on the other. This asymmetric complementary design provides built-in mechanical guidance and tolerance compensation, reducing alignment precision requirements by allowing self-correction during the bonding process rather than requiring perfect pre-alignment.