Dual-Substrate Display With Conductive Vias for HMD Fabrication
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Solution Overview
Problem
Existing head-mounted display devices face challenges in achieving high-resolution images due to the limitations of current display technologies, particularly in efficiently connecting multiple semiconductor substrates for improved image quality and fabrication yield.
Innovation Solution
A display device utilizing two different single crystal semiconductor substrates with efficient through-hole connections and conductive vias, allowing for high-resolution images and improved fabrication yield through a specific fabrication method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple semiconductor substrates are used to achieve high-resolution images, then image resolution is improved, but device complexity and fabrication difficulty increase
Solution Approach 1:
The display device is divided into multiple independent semiconductor substrates: a first substrate containing driving circuits and a second substrate containing display elements. This segmentation allows each substrate to be optimized for its specific function while achieving high overall resolution through the combination of multiple substrates.
Solution Approach 2:
A carrier substrate is introduced as an intermediary component to temporarily hold and align the first and second semiconductor substrates during the bonding process. This carrier substrate facilitates the complex alignment and connection of multiple substrates, reducing the direct complexity of connecting them directly to each other.
2Reliability
If through holes are used to connect multiple substrates, then electrical connection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The carrier substrate serves as a mediator that provides a stable platform for forming through holes that penetrate both the first and second semiconductor substrates. This intermediary structure simplifies the alignment process and reduces the precision requirements for directly connecting the two semiconductor substrates.
Solution Approach 2:
The through holes are formed in the carrier substrate before bonding the semiconductor substrates together. This preliminary action allows for easier alignment and formation of conductive vias, as the carrier substrate provides a rigid reference structure that simplifies the manufacturing process.
3Ease of manufacture
If conventional substrate connection methods are used, then fabrication process is simpler, but fabrication yield decreases
Solution Approach 1:
By segmenting the display device into separate first and second semiconductor substrates with distinct functions, each substrate can be fabricated using optimized processes for its specific requirements. This segmentation enables higher yield for each individual substrate while maintaining overall fabrication efficiency.
Solution Approach 2:
The carrier substrate acts as a temporary intermediary that simplifies the assembly process. It provides a stable platform for aligning and bonding the semiconductor substrates, reducing the complexity of the fabrication process while improving yield through better alignment and reduced defects.
Data Source
AI summary
A display device, a method for fabrication thereof, and a head mounted display device are provided. A display device includes a first single crystal semiconductor substrate on which a plurality of first transistors is formed, a driving circuit layer being on the first single crystal semiconductor substrate; a second single crystal semiconductor substrate on the first single crystal semiconductor substrate, the second single crystal semiconductor substrate having thereon a display element layer including a plurality of sub-pixels including a plurality of light emitting elements; and a connection wiring layer between the display element layer and the first single crystal semiconductor substrate, where the second single crystal semiconductor substrate includes a plurality of first through holes, and a conductive via in each of the plurality of first through holes, the conductive via being electrically connected to the light emitting element of each of the plurality of sub-pixels.