Dual-Substrate Packaging Layout for Heat Dissipation and Cost Control
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Solution Overview
Problem
Existing power semiconductor devices face limitations in heat dissipation capability due to low thermal conductivity of ceramic insulation layers, particularly Al2O3, which hinders the improvement of heat dissipation as devices become lighter, thinner, and higher in power density, and this is exacerbated by the high costs associated with alternative materials like AlN and Si3N4.
Innovation Solution
A packaging device is designed with a first circuit substrate having a high thermal conductivity insulation layer and a second circuit substrate with a low thermal conductivity insulation layer, allowing for flexible layout and electrical connections, and optionally integrated thermally conductive layers to enhance heat dissipation while reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If Al2O3 ceramic insulation layer is used in DBC substrate, then costs are low and process is mature, but thermal conductivity is low (24 W/mK) and heat dissipation capability is limited
Solution Approach 1:
The patent applies local quality by differentiating the insulation layer into two types: a first insulation layer with high thermal conductivity for high power density areas, and a second insulation layer with lower thermal conductivity for low power density areas. This localized differentiation allows each region to have the appropriate thermal properties for its specific power requirements, resolving the contradiction between cost and heat dissipation capability.
Solution Approach 2:
The patent uses composite materials by combining different insulation layer materials with different thermal conductivities in a single DBC substrate structure. The first insulation layer (high thermal conductivity) and second insulation layer (lower thermal conductivity) work together as a composite system, allowing the substrate to achieve both cost-effectiveness and superior heat dissipation performance simultaneously.
2Temperature
If AlN or Si3N4 ceramic materials are used to improve heat dissipation, then thermal conductivity increases, but costs increase significantly
Solution Approach 1:
The patent applies local quality by using high thermal conductivity materials (first insulation layer) only in regions with high power density requirements, while using lower cost materials (second insulation layer) in regions with lower power density. This localized approach achieves the necessary heat dissipation improvement without incurring the high costs of using expensive materials throughout the entire substrate.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the insulation layer by introducing a first insulation layer with high thermal conductivity in specific regions. This parameter change allows the system to achieve improved heat dissipation capability while controlling costs by not uniformly applying high-performance materials across the entire substrate.
3Volume of moving object
If power semiconductor device volume is reduced and power density is increased, then device becomes lighter and more compact, but heat dissipation capability becomes limited due to low thermal conductivity of Al2O3
Solution Approach 1:
The patent applies local quality by strategically placing the first insulation layer with high thermal conductivity in regions where high power density generates significant heat, while using the second insulation layer in regions with lower heat generation. This allows the compact device to maintain effective heat dissipation despite reduced overall volume.
Solution Approach 2:
The patent uses composite materials to create a DBC substrate that combines different insulation layer materials with different thermal conductivities. This composite structure enables the device to achieve both compact size and effective heat dissipation by optimizing the thermal properties of specific regions within the limited volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation capability and reduces overall costs by optimizing insulation layer thermal conductivities based on power density, enabling flexible layouts and efficient heat conduction, while maintaining electrical connectivity and structural integrity.
Implementation Method 1
A thermal conductivity of the first insulation layer is higher than a thermal conductivity of the second insulation layer
Implementation Method 2
The first circuit substrate includes a first line layer and a first insulation layer that are sequentially stacked, and at least one first electronic component is disposed on the first circuit substrate. The second circuit substrate includes a second line layer and a second insulation layer that are sequentially stacked
Data Source
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AI summary
This application provides a packaging device. The packaging device includes a first circuit substrate and a second circuit substrate that are electrically connected. The first circuit substrate includes a first line layer and a first insulation layer that are sequentially stacked, and a first electronic component is disposed on the first circuit substrate. The second circuit substrate includes a second line layer and a second insulation layer that are sequentially stacked, and a second electronic component is disposed on the second circuit substrate. A thermal conductivity of the first insulation layer is higher than a thermal conductivity of the second insulation layer. This application further provides a packaging module and an electronic device in which the packaging device is used. According to the packaging device in this application, the first insulation layer and the second insulation layer with different thermal conductivities are targetedly configured, and layouts of the first circuit substrate and the second circuit substrate are flexible. Therefore, a heat dissipation capability of the packaging device can be improved to a maximum extent, and comprehensive costs of the packaging device can be reduced.