Dual-Substrate Image Sensor Mounting Board Thermal Warping

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Solution Overview

Problem

Image sensor mounting boards with organic substrates are prone to deformation under heat, leading to misalignment of optical axes during the mounting and use of image sensors, which affects the accuracy of imaging devices and modules.

Innovation Solution

A dual-substrate structure is introduced, where a first substrate with an organic material has a recess to house a second substrate made of inorganic material, reducing thermal deformation and maintaining optical axis alignment by distributing heat away from the organic substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If an organic substrate is used for the image sensor mounting board, then ease of manufacture is improved, but thermal stability deteriorates causing warping under heat

Engineering Contradiction:
Improveease of manufactureVSAvoidthermal stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The mounting board is divided into two separate substrates: a first substrate made of organic material and a second substrate made of inorganic material. This segmentation allows each substrate to perform its specialized function - the organic substrate provides ease of manufacture while the inorganic substrate provides thermal stability and prevents warping under heat.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mounting board uses a composite structure combining organic and inorganic materials. The first substrate (organic) and second substrate (inorganic) are bonded together to create a composite mounting board that exhibits both the manufacturability advantages of organic materials and the thermal stability advantages of inorganic materials.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If an organic substrate is used for the image sensor mounting board, then ease of manufacture is improved, but optical alignment precision deteriorates due to warping

Engineering Contradiction:
Improveease of manufactureVSAvoidoptical alignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

By segmenting the mounting board into two substrates, the inorganic second substrate provides a stable, non-warping platform that ensures precise optical alignment between the image sensor and lens, while the organic first substrate maintains ease of manufacture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The composite structure of organic and inorganic substrates combines the manufacturability benefits of organic materials with the dimensional stability and precision benefits of inorganic materials, achieving both ease of manufacture and optical alignment precision.

Inventive Principle:
Principle #40Composite materials

3Stability of the object's composition

If heat-resistant inorganic material is used for the second substrate, then thermal stability is improved, but device complexity increases due to dual-substrate structure

Engineering Contradiction:
Improvethermal stabilityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The segmentation into two substrates is implemented in a way that the second inorganic substrate is positioned within a recess of the first substrate, creating a integrated assembly that achieves thermal stability without excessive complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The second inorganic substrate is nested within the recess of the first organic substrate, creating a compact integrated structure. This nesting approach achieves thermal stability while minimizing the increase in device complexity by efficiently utilizing the available space.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual-substrate structure effectively minimizes warping of the organic substrate, ensuring stable optical axis alignment and improved reliability of imaging devices and modules by using heat-resistant inorganic materials for the second substrate.

Implementation Method 1

an inorganic material can resist deformation under heat

Methodology Applied
Scientific EffectThermal resistance: Thermal Insulation

Implementation Method 2

distributing heat away from the organic substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11412111B2Image sensor mounting board, imaging device, and imaging module
Publication Date: 2022.08.09 KYOCERA CORP
  • US11412111B2 patent drawing
  • US11412111B2 patent drawing
  • US11412111B2 patent drawing

AI summary

An image sensor mounting board includes a first substrate and a second substrate. The first substrate has an upper surface with a recess and includes an organic material. The second substrate is located in the recess on the first substrate, has an upper surface on which an image sensor is mountable, and includes an inorganic material.