Dual Substrate Imaging Device Noise Isolation
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Solution Overview
Problem
In imaging devices with two substrates, high-speed pixel driving and increased pixel numbers lead to noise interference from row and column-scanning signals during analog-to-digital conversion, resulting in errors in AD conversion results.
Innovation Solution
The imaging device incorporates a first substrate with a pixel section, a row signal generation circuit generating row selection signals at a first frequency, a column signal generation circuit generating column-scanning signals at a higher second frequency, and a signal-processing circuit on the second substrate to process pixel signals, with connection nodes configured to minimize noise impact on AD conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If column-scanning signals and row selection signals operate at high frequencies to increase pixel driving speed, then productivity is improved, but noise interference increases causing measurement precision degradation
Solution Approach 1:
The patent segments the substrate into two separate substrates: one dedicated to pixel arrays and another to signal processing circuits. This physical segmentation isolates the noise-generating column-scanning circuits from the sensitive AD conversion circuits, allowing high-frequency operation without compromising conversion accuracy. The connection section with connection nodes provides controlled signal transmission between substrates.
Solution Approach 2:
The patent introduces an intermediary connection section consisting of connection nodes that transmit signals between the pixel substrate and signal processing substrate. This intermediary structure allows high-speed signal transmission while providing isolation between noise-generating and noise-sensitive circuits, effectively mediating the conflict between speed and precision.
2Measurement precision
If the number of pixels is increased to improve imaging resolution, then measurement precision is improved, but device complexity increases leading to more noise interference
Solution Approach 1:
By segmenting the imaging device into two separate substrates, the patent can accommodate a large number of pixels without proportionally increasing the complexity of each individual circuit. The pixel substrate handles only pixel arrays and basic scanning, while the signal processing substrate handles complex AD conversion and signal processing, distributing complexity across substrates.
Solution Approach 2:
The patent transitions from a single-substrate two-dimensional layout to a multi-substrate three-dimensional arrangement. This dimensional change allows complex circuits to be distributed across different physical planes, reducing inter-circuit interference and managing complexity more effectively while supporting higher pixel counts for improved resolution.
3Object-affected harmful factors
If row selection signals are generated at lower frequency to reduce noise, then noise interference is reduced, but productivity decreases due to slower pixel row selection
Solution Approach 1:
The patent separates the row selection signal generation function from the AD conversion function by placing them on different substrates. This allows row selection signals to operate at optimized frequencies for pixel driving speed without compromising AD conversion accuracy, as the conversion circuits are physically isolated from the noise.
Solution Approach 2:
The patent changes the operational parameters of different circuit blocks independently: column-scanning circuits can operate at high frequencies for fast pixel addressing, while row selection signals can be optimized for their specific function without being constrained by AD conversion noise requirements, since the circuits are separated across substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces noise interference on AD conversion circuits, enhancing the accuracy of image processing and reducing errors, particularly in high-resolution imaging applications.
Implementation Method 1
a pixel section arranged on the first substrate and including a plurality of pixels arranged in a matrix form outputting pixel signals according to incident light
Data Source
AI summary
An imaging device includes a first substrate, a second substrate, a plurality of connection nodes which electrically connect the first and second substrates, a pixel section arranged on the first substrate and including a plurality of pixels arranged in a matrix form, the plurality of pixels outputting pixel signals according to incident light, a row signal generation circuit arranged on the first substrate or the second substrate and configured to generate row selection signals, a column signal generation circuit arranged on the first substrate and configured to generate column-scanning signals, a block of column-scanning circuits arranged on the first substrate and which sequentially outputs the pixel signals output to every row from the pixels by scanning the columns according to the column-scanning signals, to every column, and a signal-processing circuit arranged on the second substrate and configured to process the pixel signals output from the block of column-scanning circuits.