Dual-Substrate Electronic Module for Height Reduction
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Solution Overview
Problem
There is a demand for electronic component modules that can be miniaturized and thinned to accommodate the increasing demand for portable electronic devices while maintaining high performance and functionality, requiring a package technology that reduces mounting height and increases mounting area efficiently.
Innovation Solution
The electronic component module design involves using both surfaces of a substrate for mounting, with a first substrate mounted on a second substrate such that its lower surface is exposed, allowing for reduced mounting height and increased area, and includes features like a heat dissipation pad and shielding layers to manage heat and electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are miniaturized to reduce size, then mounting area is reduced, but mounting height increases
Solution Approach 1:
The patent utilizes both upper and lower surfaces of the substrate for mounting electronic components, transitioning from single-surface mounting to dual-surface mounting. This dimensional change effectively doubles the available mounting area without increasing the footprint, thereby reducing the need to increase mounting height to accommodate multiple components.
2Area of stationary object
If mounting area is increased to accommodate more components, then substrate size increases, but device thickness increases
Solution Approach 1:
The invention mounts components on both the upper and lower surfaces of the substrate, effectively utilizing the third dimension (z-axis) of the substrate structure. This approach increases the total mounting area without expanding the substrate's planar dimensions, thereby maintaining device thickness while accommodating more components.
3Volume of moving object
If components are integrated into a compact structure, then heat dissipation becomes difficult, but heat generating elements require effective cooling
Solution Approach 1:
The patent separates heat-generating components from heat-sensitive components by mounting them on different surfaces of the substrate. Heat-generating elements on one surface can be directed toward heat sinks or ventilation areas, while heat-sensitive components on the opposite surface are protected from thermal exposure. This spatial segmentation enables effective heat management in a compact structure.
4Length of stationary object
If substrate thickness is reduced to achieve thinning, then structural support and heat dissipation capability are compromised
Solution Approach 1:
The patent employs a composite substrate structure combining materials with different properties - such as high-strength structural layers for mechanical support and high-thermal-conductivity layers for heat dissipation. This composite construction enables the substrate to maintain adequate thickness for structural integrity and thermal management while achieving overall device thinning through optimized material selection and layer configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves significant reduction in mounting height, increased integration of electronic devices, and effective heat dissipation, facilitating the miniaturization and thinning of electronic components while maintaining performance.
Implementation Method 1
the heat dissipation pad may be in surface contact with an upper surface of a main substrate through a heat transfer member
Implementation Method 2
the heat dissipation via having one end connected to the at least one electronic device mounted on the upper surface of the second substrate and another end connected to the heat dissipation pad, to transfer heat generated by the at least one electronic device
Data Source
AI summary
An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.