Dual-Substrate Electronic Module for Accessible External Connections
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Solution Overview
Problem
The challenge in miniaturizing electronic devices is the difficulty in forming external connection terminals when electronic components are mounted on both surfaces of a substrate, as the mounting position for these terminals is often obscured.
Innovation Solution
An electronic device module design featuring a first substrate with components on both sides, a second substrate coupled to the lower surface with a device accommodating portion and sealing portions to secure and expose electrode pads for external connection terminals, allowing for easy formation and manufacturing of external connection terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are mounted on both surfaces of a substrate to achieve miniaturization, then the device size is reduced, but it becomes difficult to form external connection terminals as mounting positions are obscured
Solution Approach 1:
The substrate is divided into two separate substrates (first substrate and second substrate). The first substrate mounts electronic components on its upper surface, while the second substrate mounts components on its lower surface. This segmentation allows external connection terminals to be formed on the first substrate without being obscured by components on the opposite side, as the second substrate provides a separate mounting plane.
Solution Approach 2:
The invention transitions from a single-substrate double-sided mounting approach to a multi-layer stacked configuration. By adding the vertical dimension with two substrates coupled together, external connection terminals can be accessed from the outer surfaces of the stacked structure rather than being obscured within a single substrate plane.
2Quantity of substance
If electronic components are mounted on both surfaces of a substrate, then component density increases, but the position for external connection terminal formation is obscured
Solution Approach 1:
By segmenting the mounting surfaces across two separate substrates, the external connection terminal positions on the first substrate remain accessible and unobscured. The second substrate acts as a separate layer that does not interfere with the visibility and accessibility of connection terminals on the first substrate, while still allowing high component density through its own mounting surface.
3Adaptability or versatility
If a second substrate is added to accommodate devices on the lower surface, then component mounting flexibility increases, but manufacturing complexity increases
Solution Approach 1:
The first and second substrates are coupled together through bonding surfaces to form an integrated module structure. This merging allows the system to achieve the flexibility of mounting components on both upper and lower surfaces while presenting a unified, manageable structure for manufacturing and assembly processes.
Data Source
AI summary
A electronic device module includes a first substrate; electronic devices mounted on the first substrate; a second substrate coupled to a lower surface of the first substrate, the second substrate including a device accommodating portion; a sealing portion configured to seal an electronic device in the device accommodating portion; and an external connection terminal bonded to an electrode pad disposed in a lower surface of the second substrate. Bonding surfaces of the electrode pad and the external connection terminal are disposed on a same plane as a lower surface of the sealing portion.