Dual-Substrate Sensor Module Reducing Axis Interference
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Solution Overview
Problem
Existing sensor modules with multiple sensor devices for a single sensing axis face challenges in enhancing the effectiveness and reliability of high-accuracy data collection.
Innovation Solution
A sensor module design featuring two substrates with multiple sensor devices each, configured to detect physical quantities on three axes, with a connection portion forming a link between the substrates to prevent interference and enhance accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple sensor devices for one sensing axis are mounted on the same substrate, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The sensor module is divided into two separate substrates, with each substrate carrying sensor devices for the same three sensing axes. This segmentation reduces the complexity of mounting multiple sensors on a single substrate while maintaining the capability to collect high-accuracy angular rate data through redundant measurements.
2Measurement precision
If multiple sensor devices are mounted on the same substrate, then measurement precision is improved, but reliability deteriorates due to potential interference
Solution Approach 1:
By placing sensor devices on two separate substrates, the patent reduces mutual interference between sensors while maintaining measurement precision through data fusion. The physical separation improves reliability by minimizing cross-talk and electromagnetic interference that would occur if all sensors were mounted on the same substrate.
Solution Approach 2:
A connection portion serves as an intermediary structure to link the two substrates, enabling mechanical and electrical connectivity while maintaining spatial separation between sensor devices. This intermediary structure allows the system to achieve both precision (through redundant sensing) and reliability (through reduced interference).
Data Source
AI summary
A sensor module includes a first substrate, a second substrate, and a connection portion forming a connection between the first substrate and the second substrate. The first substrate is provided with a first sensor device configured to detect a physical quantity on a first axis, a second sensor device configured to detect a physical quantity on a second axis, and a third sensor device configured to detect a physical quantity on a third axis. The second substrate is provided with a fourth sensor device configured to detect a physical quantity on the first axis, a fifth sensor device configured to detect a physical quantity on the second axis, and a sixth sensor device configured to detect a physical quantity on the third axis.