Dual Substrate IC Packaging with Spherical Interconnects

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Solution Overview

Problem

Current integrated circuit packaging systems face challenges in simplifying manufacturing processes, reducing the number of electrical parts on circuit boards, and achieving size reductions while maintaining or improving functionality and reliability, which are critical for competitive market success and cost efficiency.

Innovation Solution

The proposed solution involves a method for integrated circuit packaging that includes a base substrate with conductive materials on both sides, connected internally by spherical interconnects, and a top substrate with conductive materials facing the base substrate, allowing for three-dimensional connectivity and reduced component count through the use of internal interconnects that provide both electrical and structural support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If traditional integrated circuit packaging methods are used, then manufacturing processes are simplified, but the number of electrical parts on circuit boards remains high and size reduction is limited

Engineering Contradiction:

Improvenumber of electrical partsVSAvoidpackaging structure complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent implements package-on-package stacking where multiple integrated circuit packages are vertically nested within a single package structure. The first package contains a first integrated circuit, and a second package containing a second integrated circuit is stacked above it, creating a nested configuration that reduces the number of separate electrical parts on circuit boards while managing structural complexity through standardized interfaces

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from traditional two-dimensional circuit board layouts to three-dimensional vertical stacking. By stacking packages in the vertical dimension rather than arranging them horizontally on a circuit board, the system reduces the quantity of electrical parts visible on circuit boards while the internal package structure manages the complexity of interconnections

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If components are made thinner to reduce package size, then overall package size is reduced, but manufacturing precision and reliability become more difficult to maintain

Engineering Contradiction:

Improvepackage sizeVSAvoidcomponent thickness control

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

By nesting packages vertically rather than reducing individual component thickness, the patent achieves overall package size reduction through compact three-dimensional arrangement. This approach maintains manufacturing precision because each individual package and its components can be manufactured at standard thicknesses, avoiding the precision challenges of ultra-thin components

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent reduces package volume by utilizing the vertical dimension for stacking multiple packages, rather than reducing the thickness of individual components in the horizontal plane. This dimensional transition allows size reduction while maintaining manufacturability and reliability of each component at standard thicknesses

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If multiple integrated circuit packages are used to increase functionality, then product features improve, but the number of electrical parts on circuit boards increases

Engineering Contradiction:

Improveproduct functionalityVSAvoidelectrical parts on circuit boards

Core Design Contradiction:

Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

The patent nests multiple integrated circuit packages within a single package structure, where each package contributes different functionality. The first package contains a first integrated circuit and the second package contains a second integrated circuit, allowing enhanced product features while presenting a unified interface that reduces the effective number of electrical parts on circuit boards

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The stacked package structure serves multiple functions: it provides mechanical support for multiple integrated circuits, manages electrical interconnections between packages, and presents a reduced interface to external circuitry. This multi-functionality allows enhanced product features while reducing the quantity of electrical parts that need to be managed on circuit boards

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8106499B2Integrated circuit packaging system with a dual substrate package and method of manufacture thereof

Publication Date: 2012.01.31 STATS CHIPPAC LTD

AI summary

A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base conductive material on opposite sides of the base substrate; connecting an internal interconnect having a substantially spherical shape on the base substrate; forming a top substrate having a top conductive material on opposite sides of the top substrate with an upper component thereon facing the base substrate; and attaching the top substrate on the internal interconnect.