Dual-Substrate Wiring Board for Flexible Terminal Contact
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Solution Overview
Problem
Existing flexible printed circuits boards experience poor contact between terminals and connectors due to recessing of soft insulating base materials, and molded wiring boards face difficulty in bending terminals formed on thick, hard resin materials.
Innovation Solution
A wiring board design with substrates of different materials and moduli, where a first substrate supports the wiring and a second substrate supports the terminal, allowing for suppression of terminal dents and easy bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a soft resin material is used as the insulating base material in flexible printed circuits board, then the board can follow movement and be flexible, but the terminal dents when inserted into or removed from a connector causing poor contact
Solution Approach 1:
The patent divides the insulating base material into two segments: a soft resin material portion for flexibility and a hard resin material portion for terminal support. This segmentation allows each portion to perform its specific function optimally without compromising the other.
Solution Approach 2:
The patent applies local quality by using different material properties in different regions of the insulating base material. The terminal portion uses hard resin material to prevent denting and ensure reliable contact, while other portions use soft resin material to maintain flexibility and adaptability.
2Reliability
If a hard resin material is used as the insulating base material in molded wiring board, then the terminal can maintain contact reliability, but the terminal portion becomes difficult to bend even when desired
Solution Approach 1:
The patent segments the insulating base material into hard resin material portion for terminal support and soft resin material portion for bending flexibility. This allows the terminal portion to maintain contact reliability while other portions remain easily bendable.
Solution Approach 2:
The patent implements local quality by assigning hard resin material to the terminal portion for reliable contact and soft resin material to other portions for ease of bending. This localized material assignment resolves the contradiction between contact reliability and bending ease.
3Strength
If the insulating base material is made thicker, then the structural strength is improved, but the terminal portion becomes harder to bend
Solution Approach 1:
The patent applies local quality by making the insulating base material thicker only in specific regions where structural strength is needed, while keeping other regions thinner to maintain bending ease. This localized thickness variation resolves the contradiction between overall strength and bending flexibility.
Data Source
AI summary
A wiring board includes a first substrate, a second substrate composed of a material different from a material of the first substrate, a wiring supported by the first substrate, and a terminal supported by the second substrate and connected to the wiring. The first and second substrates are disposed on a same side with respect to the wiring. In a plan view, the first substrate overlaps the wiring but not the terminal. In the plan view, the second substrate overlaps the terminal.