Dual Substrate Electronic Device Warpage Management
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Solution Overview
Problem
In electronic devices, forming conductive layers on the same substrate with a dielectric layer to separate them by an appropriate distance can lead to substrate warpage issues, particularly when the dielectric layer is too thick, necessitating a method that effectively separates conductive layers while managing warpage.
Innovation Solution
A manufacturing method involving two substrates with conductive structures, where each substrate has a conductive layer and a dielectric layer, and the substrates are combined with a glue, allowing for the formation of a through hole to electrically connect the conductive layers, thereby maintaining the necessary distance between conductive layers without the warpage issues associated with thick dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a thick dielectric layer is used to separate two conductive layers on the same substrate, then the distance between conductive layers is increased, but substrate warpage occurs
Solution Approach 1:
The patent divides the single substrate structure into two separate substrates (first substrate and second substrate), each carrying one conductive layer. This segmentation eliminates the need for a thick dielectric layer on a single substrate, thereby preventing substrate warpage while maintaining the required distance between conductive layers through the combination of two thinner substrates.
2Device complexity
If two conductive layers are formed on the same substrate with a dielectric layer, then the process is simplified, but substrate warpage occurs when the dielectric layer is too thick
Solution Approach 1:
The patent segments the device into two separate substrates with their respective conductive layers, which are then combined. This approach distributes the structural complexity across two independent components, each easier to manufacture without warpage, while the overall device complexity is managed through the combination process.
Solution Approach 2:
The patent employs a carrier structure that temporarily holds the first substrate, and later the second substrate is combined with it. The carriers act as temporary supporting structures during manufacturing, enabling precise assembly while protecting the substrates from warpage during processing.
3Stability of the object's composition
If two substrates are combined with separate conductive structures, then substrate warpage is minimized, but the manufacturing process becomes more complex
Solution Approach 1:
The patent uses carriers as temporary supporting structures during the manufacturing process. The first carrier holds the first substrate, and the second carrier holds the second substrate. These carriers are removed after the substrates are combined, simplifying the overall manufacturing process despite the multi-step nature of the operation.
Solution Approach 2:
The patent performs preliminary actions by forming conductive structures on each substrate separately while they are still on their respective carriers. This preliminary preparation allows for independent optimization of each substrate's conductive layer formation, reducing the complexity of the overall process compared to forming all layers on a single substrate.
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
An electronic device (1, 1') and a manufacturing method thereof are provided. The manufacturing method of the electronic device (1, 1') includes the following steps. A first carrier (C1) is provided. A first substrate (SUB1) is disposed on the first carrier (C1). A first conductive structure (CS1) is disposed on the first substrate (SUB1), and the first carrier (C1) is removed. A second carrier (C2) is provided. A second substrate (SUB2) is disposed on the second carrier (C2). A second conductive structure (CS2) is disposed on the second substrate (SUB2), and the second carrier (C2) is removed. The first substrate (SUB1) and the second substrate (SUB2) are combined.