Dual Suction Pick Control for Warped Substrate Transfer
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Solution Overview
Problem
Existing technologies struggle to effectively suction and transfer warped substrates.
Innovation Solution
A processing apparatus with a pick equipped with first and second suction pads and pressure sensors to adapt to concave and convex substrate curves, respectively, allowing controlled suction operations based on pressure detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single suction pad is used to hold the substrate, then the structure is simple, but it cannot effectively suction warped substrates with varying curvatures
Solution Approach 1:
The suction pad is divided into multiple independent suction regions (first suction region, second suction region, third suction region) with different suction forces. Each region can independently adjust its suction pressure to adapt to different parts of the warped substrate, allowing the system to handle substrates with varying curvatures while maintaining a relatively simple overall structure.
Solution Approach 2:
Different suction forces are applied to different regions of the substrate based on their local curvature characteristics. The first suction region applies stronger suction to concave portions, the second suction region applies weaker suction to convex portions, and the third suction region provides additional support. This local differentiation enables effective suction of warped substrates without requiring a completely complex multi-pad system.
2Reliability
If suction force is increased to hold warped substrates, then holding reliability improves, but substrate deformation increases
Solution Approach 1:
The suction pad applies different suction forces to different regions of the substrate. The first suction region applies stronger suction force to ensure reliable holding, while the second suction region applies weaker suction force to minimize deformation. This local differentiation allows the system to maintain high holding reliability without causing excessive substrate deformation.
Solution Approach 2:
The suction pad is segmented into multiple independent suction regions that can be controlled separately. This segmentation allows the system to apply optimized suction forces to different areas, ensuring reliable holding of warped substrates while minimizing overall deformation through coordinated control of each region.
3Adaptability or versatility
If multiple suction pads with different suction forces are used, then warped substrate handling improves, but control complexity increases
Solution Approach 1:
The suction control unit adjusts the suction forces of different suction regions based on feedback from pressure sensors. The pressure sensors detect the actual suction pressure in each region, and the control unit uses this information to dynamically adjust the suction forces, ensuring optimal handling of warped substrates while automating the control process to manage complexity.
Solution Approach 2:
The suction control unit serves multiple functions: it controls the suction forces of different suction regions, receives feedback from pressure sensors, and automatically adjusts parameters to handle various substrate curvatures. This multi-functionality consolidates the control system, managing complexity while maintaining high adaptability for warped substrate handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the suction and transfer of warped substrates by ensuring proper contact and support, reducing leaks and maintaining suction force, thereby facilitating the handling of substrates with varying curvatures.
Implementation Method 1
a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a convexly curved substrate
Data Source
AI summary
A processing apparatus includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a convexly curved substrate, a pressure sensor configured to detect a pressure in a first suction path connected to the first suction pad and a pressure in a second suction path connected to the second suction pad, and a controller configured to control suction operations by the first suction pad and the second suction pad based on a detection value of the pressure sensor.