Dual-Surface Antenna Module Using One RFIC for Flexible Mounting
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Solution Overview
Problem
Existing electronic devices face challenges in efficiently operating multiple antenna modules due to increased production costs and limited mounting flexibility, particularly when using multiple RFICs and FPCBs.
Innovation Solution
The solution involves an electronic device with an antenna module that utilizes a single RFIC and a single FPCB to operate multiple array antennas, allowing for greater flexibility in antenna arrangement and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple RFICs and FPCBs are employed to operate multiple antenna modules, then the communication performance and signal diversity are improved, but the production cost and device complexity increase proportionally
Solution Approach 1:
The patent combines multiple antenna modules into a single integrated antenna module that includes a first array antenna on a first surface and a second array antenna on a second surface of the same substrate, sharing common RFICs and FPCBs. This merging approach maintains the communication performance and signal diversity of multiple antennas while reducing device complexity and production costs by eliminating the need for separate RFICs and FPCBs for each antenna module.
Solution Approach 2:
The patent implements multi-functionality by designing a single antenna module that can perform multiple antenna functions simultaneously. The first and second array antennas, disposed on opposite surfaces of the same substrate, can operate independently to provide diverse communication signals, making the single module equivalent to multiple separate antenna modules in terms of functionality while reducing overall system complexity.
2Adaptability or versatility
If multiple RFICs and FPCBs are employed to operate multiple antenna modules, then the antenna functionality and signal diversity are improved, but the production cost increases
Solution Approach 1:
The patent merges multiple antenna modules into a single integrated structure where the first array antenna and second array antenna share common RFICs and FPCBs. This consolidation maintains full antenna functionality and signal diversity while significantly reducing production costs by decreasing the number of discrete components that need to be manufactured and assembled.
3Reliability
If multiple antenna modules are connected through FPCB, then the signal diversity is improved, but the mounting position flexibility is limited
Solution Approach 1:
The patent utilizes the third dimension by disposing the first array antenna on a first surface and the second array antenna on a second surface of the same substrate, with the surfaces being parallel to each other. This spatial arrangement in opposite directions provides full signal diversity while enabling flexible mounting positions within the electronic device, as the compact dual-surface structure can be integrated into various device configurations without requiring extensive FPCB routing.
Data Source
AI summary
Disclosed is an electronic device including an antenna module comprising a first array antenna disposed on a first surface, a radio frequency integrated circuit (RFIC) disposed on a second surface which is parallel to the first surface, and a connector, a wireless communication circuit electrically connected with the antenna module through the connector, and a flexible printed circuit board (FPCB) electrically connected with the antenna module through the connector, the FPCB comprising a second array antenna, wherein the wireless communication circuit is configured to transmit and receive a first signal via the first array antenna, and to transmit and receive a second signal which is distinct from the first signal via the second array antenna.