Non-Contact Sensing Module Dual-Surface Coil PCB Design
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Solution Overview
Problem
Conventional non-contact proximity sensors for vehicle brake pedals suffer from deteriorated sensing performance and reliability due to the lack of a separate means for accurate displacement recognition, leading to instability in switching operations and increased production costs with multi-layered coil structures.
Innovation Solution
A non-contact sensing module with a coil printed circuit board featuring a reference pattern coil on the upper surface and a sensing pattern coil on the lower surface, connected through a mounting hole to a main printed circuit board without interference, allowing for independent connections and reducing the thickness and cost of the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a coil is formed at both surfaces of a printed circuit board to improve sensing performance, then the sensing accuracy is improved, but the printed circuit board thickness and production cost increase due to requiring a multi-layered four-layer structure
Solution Approach 1:
The patent transitions from a planar single-surface coil arrangement to a three-dimensional both-surface arrangement. By forming coils on both the front and back surfaces of the printed circuit board and connecting them through vertical connection paths, the invention utilizes the third dimension (depth/thickness) to accommodate additional sensing elements without requiring a proportional increase in overall board thickness. This dimensional transition allows dual-surface coil implementation while maintaining compact form factor.
Solution Approach 2:
The patent divides the coil structure into separate segments located on different surfaces of the printed circuit board. The front surface contains a first coil and the back surface contains a second coil, with each coil being independently formed and connected to circuit traces. This segmentation allows each coil to function as an independent sensing element while sharing the same substrate, improving sensing accuracy without requiring a complete multi-layered structure for the entire board.
2Device complexity
If only a single coil is formed in the printed circuit board, then the structure is simple, but the sensing performance and reliability are deteriorated
Solution Approach 1:
The patent applies different functional qualities to different locations of the printed circuit board. The front surface coil is optimized for detecting certain aspects of brake pedal displacement, while the back surface coil is optimized for complementary detection. Each coil can be independently tuned and positioned to detect specific sensing parameters, creating local optimization that enhances overall system reliability without requiring complete structural redesign.
Solution Approach 2:
The dual-coil configuration enables feedback mechanisms where the output from one coil can be used to validate or complement the output from the other coil. This cross-validation capability improves sensing reliability by providing redundant measurement pathways, allowing the system to detect and correct potential errors in individual coil readings, thereby enhancing overall sensing reliability while maintaining relatively simple structural implementation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the accuracy and reliability of displacement recognition and stability of switching operations while preventing frequency interference malfunctions, enabling more precise sensing and cost-effective production.
Implementation Method 1
When the metal material of the sensing object approaches the coil, the non-contact proximity sensor generates an eddy current at a metal material surface by an electromagnetic induction phenomenon
Implementation Method 2
the non-contact proximity sensor generates an eddy current at a metal material surface by an electromagnetic induction phenomenon
Data Source
AI summary
A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.