Dual-Surface Connection Pads for Display Substrate Reliability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

As display devices with increasing resolution require more pixels and narrower wirings, their operational reliability is compromised by minute impacts or defects, necessitating improved connection methods for flexible printed circuit boards.

Innovation Solution

A display device design featuring first and second connection pads on different surfaces of the display substrate, with first flexible printed circuit boards connected to the upper surface pads and second flexible printed circuit boards connected to lower surface pads, enhancing connection reliability by increasing the area available for board attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the number of pixels is increased to improve resolution, then the resolution is improved, but the wiring width becomes narrower and operational reliability deteriorates

Engineering Contradiction:
Improvedisplay resolutionVSAvoidoperational reliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The connection pads are divided into two separate groups: first connection pads disposed on the front surface of the display substrate and second connection pads disposed on the rear surface. This segmentation allows flexible printed circuit boards to be connected at both surfaces, providing redundant connection paths and improving operational reliability without requiring wider wirings.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If the number of wirings is increased to support more pixels, then the pixel count increases, but the wiring width becomes narrower and reliability decreases

Engineering Contradiction:
Improvenumber of pixelsVSAvoidoperational reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The connection architecture transitions from a single-surface connection to a dual-surface connection by disposing second connection pads on the rear surface of the display substrate. This dimensional change in the connection layout allows flexible printed circuit boards to be attached at both surfaces, effectively doubling the connection capacity without increasing wiring density on any single surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If connection pads are concentrated on one surface, then the connection structure is simple, but the area available for flexible printed circuit board attachment is limited

Engineering Contradiction:
Improveconnection structure complexityVSAvoidattachment area
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The connection pads are distributed across two dimensions - the front surface and the rear surface of the display substrate. This spatial distribution effectively doubles the available attachment area for flexible printed circuit boards, allowing for more robust connections without increasing the complexity of the connection structure significantly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10901276B2Display device
Publication Date: 2021.01.26 SAMSUNG DISPLAY CO LTD
  • US10901276B2 patent drawing
  • US10901276B2 patent drawing
  • US10901276B2 patent drawing

AI summary

A display device includes a display substrate comprising a plurality of pixels electrically connected to select lines and data lines; first connection pads disposed on an upper surface of the display substrate and electrically connected to the pixels; and second connection pads disposed on a surface of the display substrate that is different from the upper surface and electrically connected to the pixels, wherein the second connection pads are electrically separated from the first connection pads. This allows the area of a surface of a display substrate that can be occupied by a flexible printed circuit board attached thereto to be increased. As a result, the risk of an open-circuit of the wiring can be reduced, and the operational reliability of the device can be improved.