Dual-Surface Cooling Plate for Electronic Component Units
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Solution Overview
Problem
Conventional electronic component cooling systems for laser devices are inefficient in managing high heat generation in power supply units, particularly in utilizing the cooling surfaces of cooling plates effectively.
Innovation Solution
The proposed electronic component unit employs a dual-surface cooling plate configuration where one surface of the cooling plate is used for cooling high heat-generating components directly, while the other surface is utilized via thermal conduction units, allowing for efficient heat dissipation without the need for additional cooling plates on each circuit board, thereby optimizing the use of cooling surfaces and reducing the overall thickness and cost of the power supply unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cooling plate is provided for each circuit board, then cooling efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the cooling functions for both circuit boards into a single cooling plate. The cooling plate has a first cooling surface that contacts the first circuit board and a second cooling surface that contacts the second circuit board, allowing one cooling plate to serve both circuit boards simultaneously, thereby reducing the total number of cooling plates from two to one.
Solution Approach 2:
The single cooling plate is designed to perform multiple cooling functions by utilizing both of its surfaces. The first cooling surface cools the first circuit board while the second cooling surface cools the second circuit board, making the cooling plate a multi-functional component that replaces what would traditionally require two separate cooling plates.
2Reliability
If additional cooling plates are added for each circuit board, then cooling performance is improved, but device thickness increases
Solution Approach 1:
The patent combines the cooling functions for both circuit boards into a single cooling plate structure. Instead of stacking two separate cooling plates (one for each circuit board) which would increase thickness, the invention uses one cooling plate with dual cooling surfaces, maintaining a compact thickness while achieving cooling for both boards.
3Ease of manufacture
If conventional cooling methods are used, then manufacturing is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The cooling plate is segmented into distinct functional zones with a first cooling surface for the first circuit board and a second cooling surface for the second circuit board. This segmentation allows optimized heat dissipation for each circuit board's specific thermal requirements while maintaining a simple integrated structure that is easy to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the cooling efficiency of high heat-generating components, reduces the thickness and weight of the power supply unit, and minimizes installation space and manufacturing costs by effectively utilizing both sides of the cooling plate for heat dissipation.
Implementation Method 1
the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate
Implementation Method 2
the cooling plate includes: a first thermal conduction unit (for example, a first heat sink 25 which will be described later) which is provided between the first cooling surface and the second surface of the first circuit board; and a second thermal conduction unit (for example, a second heat sink 26 which will be described later) which is provided between the second cooling surface and the second surface of the second circuit board
Data Source
AI summary
An electronic component unit includes: first electronic components which do not need to be cooled; second electronic components which are cooled; a first circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; a second circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; and one cooling plate which includes a first cooling surface and a second cooling surface, the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.