Dual-Surface Glass Substrate Wiring for Image Sensor Integration
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Solution Overview
Problem
Existing image capturing units using the COG technique only utilize one surface of the glass substrate for wiring patterns and circuit connections, limiting the effective use of the substrate and increasing the number of reflecting surfaces in the optical path.
Innovation Solution
The image capturing unit employs a glass substrate with wiring patterns on both surfaces, connecting an image sensor and piezoelectric elements to both surfaces via through holes and anisotropic electrically conductive materials, allowing for a single system for electrical connection and reducing the need for additional flexible printed circuits, while using infra-red radiation absorbent glass and a UV/IR cutoff coating to enhance light transmission and reduce dust accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the image sensor and thin electrically conductive layer are disposed upon only one surface of the glass substrate, then the image sensor can be electrically connected to the wiring patterns, but only one surface of the glass substrate is used for wiring patterns and circuits, limiting substrate utilization
Solution Approach 1:
The patent transitions from using only one surface of the glass substrate to utilizing both surfaces for wiring patterns and circuits. By providing first wiring patterns on the first surface and second wiring patterns on the second surface, the invention effectively adds a dimensional aspect to the wiring layout, doubling the available substrate area for electrical connections and improving overall substrate utilization.
Solution Approach 2:
The wiring system is segmented into two independent sets: first wiring patterns on the first surface and second wiring patterns on the second surface. Each set can independently connect to components mounted on that surface, allowing parallel electrical connection systems that reduce complexity by distributing wiring functions across both surfaces rather than concentrating all wiring on one side.
2Device complexity
If wiring patterns and circuits are provided on only one surface of the glass substrate, then the connection system is simplified, but the number of reflecting surfaces in the optical path increases
Solution Approach 1:
The invention extracts the wiring and circuit functions from the optical path side and relocates them to the rear surface of the glass substrate. By providing second wiring patterns on the second surface for connecting components like the piezoelectric element, the wiring is removed from the optical path, eliminating the harmful reflecting surfaces while maintaining a simplified connection system through surface-specific wiring assignments.
3Ease of operation
If separate connection systems are used for the image sensor and piezoelectric element, then each component can be independently connected, but the device becomes less compact and more costly
Solution Approach 1:
The patent merges the connection systems for the image sensor and piezoelectric element by utilizing the dual-surface wiring structure. The first wiring patterns on the first surface connect to the image sensor, while the second wiring patterns on the second surface connect to the piezoelectric element. This unified dual-surface approach consolidates what would otherwise require separate connection systems, reducing overall device complexity and size while maintaining independent component connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the effective use of both substrate surfaces for wiring, reduces the number of optical path reflections, unifies the wiring for the image sensor and piezoelectric elements, makes the device more compact and cost-effective, and enhances infra-red light cutoff performance.
Implementation Method 1
a piezoelectric element that is disposed upon the first surface or upon the second surface, and that is electrically connected to the first wiring pattern
Implementation Method 2
the glass substrate has a property of absorbing infra-red radiation
Implementation Method 3
a flexible printed circuit that is disposed upon the first surface, and that is electrically connected to the first wiring pattern via a layer of an anisotropic electrically conductive material
Data Source
AI summary
An image capturing unit includes: a glass substrate having a first surface and a second surface on an opposite side to the first surface, with a first wiring pattern being provided upon at least the first surface; an image sensor that is electrically connected to the first wiring pattern, and that is mounted upon the first surface of the glass substrate; and a piezoelectric element that is disposed upon the first surface or upon the second surface, and that is electrically connected to the first wiring pattern.