Dual-Surface Interconnect Mechanism for Lower-Torque Camera Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image capture devices impart undesirable torque to mounting surfaces when mounted, leading to user discomfort and suboptimal video perspectives.
Innovation Solution
The image capture device features dual interconnect mechanisms that allow for multiple mounting configurations, reducing torque and enabling closer mounting to the user, thereby improving user comfort and immersive video capture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single interconnect mechanism is used to mount the image capture device, then the device can be securely attached to the mounting surface, but it imparts undesirable torque to the mounting surface causing user discomfort
Solution Approach 1:
The patent divides the single interconnect mechanism into two separate interconnect mechanisms: a first interconnect mechanism coupled to the bottom surface and a second interconnect mechanism coupled to the back surface. This segmentation allows the device to be mounted more centrally on the user's head, distributing the weight and reducing torque on the mounting surface while maintaining secure attachment.
2Reliability
If the interconnect mechanism is positioned away from the user's head to ensure secure mounting, then the device can be firmly attached, but the distance from the user's perspective increases causing suboptimal video perspectives
Solution Approach 1:
The patent utilizes multiple surfaces (bottom surface and back surface) of the device body to position interconnect mechanisms in different spatial dimensions. This allows the device to be mounted closer to the user's head by leveraging the back surface interconnect, while still achieving secure attachment through the distributed mounting approach, thereby improving video perspective accuracy.
3Strength
If the interconnect mechanism is designed to extend away from the device body for secure connection, then the mounting connection is strengthened, but the device center of mass moves away from the mounting surface increasing torque
Solution Approach 1:
By segmenting the interconnect mechanisms to attach to different surfaces (bottom and back), the patent enables the device to achieve strong connections without concentrating all connection points in one location. This distributed configuration allows the center of mass to remain closer to the mounting surface, reducing torque while maintaining connection strength through multiple attachment points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual interconnect mechanisms minimize torque on mounting surfaces, enhancing user comfort and providing a more immersive video experience by aligning the lens with the user's perspective.
Implementation Method 1
A first interconnect mechanism is rotatably coupled to the bottom surface, has a collapsed position and an extended position, and extends away from the bottom surface in both the extended position and the collapsed position. A second interconnect mechanism is rotatably coupled to the recessed surface, has a collapsed position and an extended position, and extends away from the back surface in the extended position and is approximately flush with the back surface in the collapsed position.
Implementation Method 2
the back surface includes fins configured to dissipate heat
Implementation Method 3
the first interconnect mechanism includes folding protrusions that are configured to rotate toward each other to move from the collapsed position to the extended position
Data Source
AI summary
A camera housing includes a first surface and a second surface noncoplanar with the first surface. A first interconnect mechanism is coupled to the first surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the first interconnect mechanism extend parallel to the first surface. In the extended position, the protrusions of the first interconnect mechanism extend in a perpendicular manner away from the first surface. A second interconnect mechanism is coupled to the second surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the second interconnect mechanism include coplanar surfaces and extend adjacent to the second surface. In the extended position, the protrusions of the second interconnect mechanism extend in a perpendicular manner away from the second surface.