Dual-Surface Package Substrate I/O Expansion
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Solution Overview
Problem
Current electronic package assemblies face challenges in reducing size and increasing functionality while maintaining thin and lightweight designs, leading to increased manufacturing costs due to the need for larger substrates with higher integration density and increased I/O pads.
Innovation Solution
The electronic package assembly incorporates a package substrate with conductive pads on both surfaces, a chip mounted on one surface, and a circuit board on the other, with electrical contact components connecting through an encapsulation layer or cover plate, allowing for additional conductive paths without increasing substrate size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of I/O pads is increased to meet market demand for increased functionality, then the functionality of electronic products is improved, but the size of the electronic package assembly and package substrate must be increased
Solution Approach 1:
The patent introduces an additional electrical connection dimension by placing conductive pads on both the top surface and bottom surface of the package substrate. This allows I/O pads to be distributed across multiple surfaces rather than confined to a single plane, effectively increasing functionality without expanding the substrate's footprint area.
Solution Approach 2:
The patent employs a stacked configuration where the chip, package substrate, and circuit board are vertically arranged. This nesting approach allows multiple functional layers to occupy the same horizontal space, increasing integration density and I/O capacity without increasing the overall package area.
2Adaptability or versatility
If the number of I/O pads is increased to increase functionality, then the functionality of electronic products is improved, but the manufacturing cost is increased
Solution Approach 1:
By utilizing the bottom surface of the package substrate for additional conductive pads and electrical connections, the patent effectively doubles the available connection area without requiring additional substrate layers or complex multi-layer structures, thereby increasing functionality while controlling manufacturing complexity and cost.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the chip, establishes electrical connections through conductive pads on both surfaces, and interfaces with the circuit board. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
3Quantity of substance
If the size of the electronic package assembly is increased to accommodate more I/O pads, then the number of I/O pads is increased, but the electronic products cannot be made thin and lightweight
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of I/O pads to a three-dimensional configuration by utilizing both top and bottom surfaces of the package substrate. This allows a greater number of I/O pads to be accommodated within the same horizontal footprint, enabling thin and lightweight product design while maintaining high I/O density.
Solution Approach 2:
The patent employs a composite structure combining the package substrate with an encapsulation layer and circuit board. This composite approach allows for compact vertical integration of multiple functional elements, increasing I/O capacity without proportionally increasing the overall package thickness.
Data Source
AI summary
An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads.