Dual-Target Sputtering Layout to Minimize Cross Contamination
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Solution Overview
Problem
Existing sputtering apparatuses face issues with cross contamination between targets, leading to undesired film formation due to material mixing, and complex arrangements that can generate particles.
Innovation Solution
The sputtering apparatus is designed with target holders that orient the first and second targets such that their orthogonal projection vectors are directed away from the substrate, simplifying the apparatus arrangement and reducing cross contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield with movable parts is used to select targets, then cross contamination is prevented, but device complexity increases and particles are generated
Solution Approach 1:
The patent extracts the harmful function of the movable shield by removing it entirely from the system. Instead of using a shield to select targets, the invention directly exposes the selected target to the processing space through fixed openings, eliminating the movable component that causes complexity and particle generation while maintaining cross contamination prevention
Solution Approach 2:
The patent inverts the conventional approach by making the target selection mechanism static rather than dynamic. Instead of moving a shield to expose targets, fixed openings are used to expose selected targets, and unselected targets are positioned away from the processing space. This inversion eliminates movable parts while achieving the same cross contamination prevention
2Object-affected harmful factors
If a shield with movable parts is used to select targets, then cross contamination is prevented, but particle generation increases
Solution Approach 1:
The patent extracts and removes the movable shield component that generates particles during operation. By using fixed openings and positioning unselected targets away from the processing space, the system eliminates the mechanical movement that causes particle generation while maintaining effective target selection and cross contamination prevention
3Productivity
If targets are arranged to face the substrate directly, then film formation is efficient, but cross contamination occurs between targets
Solution Approach 1:
The patent applies local quality by giving different spatial positions to different targets based on their selection status. Selected targets are positioned to face the substrate through fixed openings for efficient film formation, while unselected targets are positioned away from the processing space. This localized spatial differentiation prevents cross contamination while maintaining film formation efficiency for active targets
Solution Approach 2:
The patent segments the target arrangement into distinct functional zones: selected targets are positioned in the processing space through fixed openings for film formation, while unselected targets are positioned outside the processing space. This spatial segmentation prevents material from unselected targets from contaminating the substrate while allowing efficient film formation from selected targets
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes cross contamination and particle generation while maintaining film uniformity, ensuring the formation of desired films without material mixing.
Implementation Method 1
a first film formation step of forming a first film on the substrate while sputtering the first target, and a second film formation step of forming a second film on the substrate while sputtering the second target
Data Source
AI summary
A sputtering apparatus includes a first target holder configured to hold a first target such that a first surface of the first target faces the processing space, and a second target holder configured to hold a second target such that a second surface of the second target faces the processing space, wherein the first target holder holds the first target such that an orthogonal projection vector of a first normal vector, which is a normal vector of the first surface, with respect to a virtual plane including the substrate holding surface is directed to a direction away from the substrate, and the second target holder holds the second target such that an orthogonal projection vector of a second normal vector, which is a normal vector of the second surface, with respect to the virtual plane is directed to a direction away from the substrate.