Dual-Target Sputtering Layout for Uniform Film Thickness and Composition
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Solution Overview
Problem
Existing film forming apparatuses face challenges in achieving both in-plane uniformity of film thickness and composition when simultaneously sputtering targets of different materials, due to the alignment of the target and mounting table central axes resulting in biased film deposition.
Innovation Solution
The apparatus is designed with a configuration where the target and mounting table central axes are not aligned, adjusting the distances and oscillation widths of the magnets to control the sputter electrical discharge regions, allowing for improved film thickness and in-plane uniformity by optimizing the deposition of sputter particles from targets of different materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the central axes of the target and mounting table are aligned, then the apparatus structure is simplified, but the in-plane uniformity of film thickness and composition deteriorates
Solution Approach 1:
The patent applies asymmetry by deliberately misaligning the central axis of the mounting table with the central axes of the first and second targets. Specifically, the distance from the mounting table central axis to the first target center is set to be different from the distance to the second target center. This asymmetric configuration compensates for the different emission angle distributions of sputter particles from different target materials, thereby achieving uniform film thickness and composition across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the in-plane uniformity of film thickness and composition by balancing the deposition patterns of sputter particles from targets with varying emission angle distributions, resulting in improved film quality.
Implementation Method 1
a first holder holding a first target formed of a first material; a second holder holding a second target formed of a second material different from the first material
Data Source
AI summary
There is a film forming apparatus comprising: a first holder holding a first target formed of a first material; a second holder holding a second target formed of a second material different from the first material; and a mounting table holding a substrate, the mounting table rotatable with a central axis of the mounting table as a rotation axis, wherein a distance from the central axis of the mounting table to a center of a sputter surface of the first target is different from a distance from the central axis of the mounting table to a center of a sputter surface of the second target.