Dual-Terminal Semiconductor Connection Device Using Segmented Platform and Moving Head
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Solution Overview
Problem
Existing electrical connection devices are not suited for semiconductor components with both front and rear terminals, as they primarily focus on connecting from one side, lacking the necessary infrastructure to effectively link both sets of terminals.
Innovation Solution
An electrical connection device and method that includes a platform and a moving head with a printed circuit board, allowing contact with both front and rear terminals of a semiconductor component, using interlinked pairs of contact terminals and electrical connection posts to establish connections between the chip and the test rig, enabling direct and indirect electrical test contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing electrical connection devices are used, then simple front-terminal connections are achieved, but components with both front and rear terminals cannot be properly connected
Solution Approach 1:
The connection device is segmented into distinct functional modules: a platform for front-terminal connections and a moving head with printed circuit board for rear-terminal connections. This segmentation allows each module to specialize in specific connection tasks while maintaining overall system adaptability to dual-terminal components.
Solution Approach 2:
The connection device achieves multi-functionality by combining front-terminal connection capabilities (via platform posts) and rear-terminal connection capabilities (via moving head PCB contacts). This universal design enables the same device to handle both single-terminal and dual-terminal semiconductor components effectively.
2Reliability
If connection devices are designed for single-side connections, then device simplicity is maintained, but comprehensive testing of dual-terminal components is limited
Solution Approach 1:
The connection device transitions from single-dimensional (front-side only) connections to multi-dimensional connections by adding rear-terminal access through the moving head. This dimensional expansion enables comprehensive electrical contact with all terminals of dual-terminal components, significantly improving testing completeness and reliability.
3Adaptability or versatility
If rear terminals are added to connection plates, then chip connection flexibility is improved, but existing connection devices become incompatible
Solution Approach 1:
The moving head with printed circuit board provides dynamic adaptability for rear-terminal connections. The head can be positioned and adjusted to establish electrical contact with rear terminals when needed, while the system remains compatible with traditional front-terminal-only components through the platform connection mechanism.
Data Source
AI summary
An electrical connection device includes a platform and a moving head. Between these components a semiconductor component is received and retained. The semiconductor component includes an electrical connection plate bearing an integrated circuit chip. The platform supports the making of electrical connection with front electrical connection terminals provided on a front panel of the electrical connection plate. The moving head bears a printed circuit board having interlinked pairs of contact terminals and associated pairs of electrical connection posts which make contact between the pairs of contact terminals of the printed circuit board and rear link terminals and rear transfer terminals provided on a rear panel of the electrical connection plate. The electrical connection plate includes circuitry which electrically connects the rear link terminals to the chip and also circuitry which electrically connects rear transfer terminals to front transfer terminals.