Dual Thermal Block Liquid Cooling for TEC-Off CPU Heat Control
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Solution Overview
Problem
Existing liquid cooling systems for electronic devices face inefficiencies when the thermoelectric cooler (TEC) is deactivated, leading to degraded thermal performance, increased noise, and power consumption due to higher fan speeds.
Innovation Solution
A dual thermal block design with a bottom thermal block closer to the CPU for efficient heat absorption when the TEC is off, and a controller to switch between modes based on CPU power usage, optimizing cooling and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the TEC is deactivated to reduce power consumption, then power consumption is reduced, but thermal performance degrades and noise increases due to higher fan speeds
Solution Approach 1:
The cooling system is segmented into two independent thermal blocks (first thermal block with TEC, second thermal block without TEC) that can operate independently or together. This segmentation allows the system to use only the necessary cooling component, avoiding the need to run the TEC at low temperatures and thereby reducing power consumption while maintaining adequate thermal performance.
Solution Approach 2:
The system dynamically switches between different cooling modes based on CPU power usage: using the second thermal block for low-power states, the first thermal block for high-power states, or both together for maximum cooling demand. This dynamic adaptation optimizes power consumption while maintaining appropriate thermal performance for each operating condition.
2Use of energy by moving object
If the TEC is deactivated to reduce power consumption, then power consumption is reduced, but noise increases due to higher fan speeds
Solution Approach 1:
By segmenting the cooling system into two thermal blocks, the system can provide adequate cooling without relying solely on the TEC and high fan speeds. The second thermal block supplements cooling capacity, allowing fans to operate at lower speeds and thereby reducing noise while maintaining low power consumption.
Solution Approach 2:
The second thermal block acts as an intermediary cooling component that bridges the gap when the TEC is deactivated. It provides additional cooling capacity that reduces the thermal load on the CPU, thereby allowing lower fan speeds and reducing noise without requiring the TEC to be continuously active.
3Temperature
If a single thermal block with TEC is used, then cooling capacity is sufficient for high power usage, but the system complexity increases and efficiency decreases when TEC is not needed
Solution Approach 1:
The cooling system is divided into two independent thermal blocks with separate fluid circuits, allowing each block to be optimized for specific cooling scenarios. This segmentation reduces system complexity by enabling selective operation of cooling components rather than requiring a single complex system to handle all cooling scenarios.
Solution Approach 2:
The dual thermal block system provides multi-functionality: the first thermal block handles high-power cooling scenarios, the second thermal block handles low-power scenarios, and both can work together for maximum cooling demand. This universality allows the system to adapt to different cooling requirements without increasing overall system complexity.
4Temperature
If the TEC is continuously activated, then thermal performance is maintained, but power consumption increases
Solution Approach 1:
The system dynamically adjusts TEC operation based on CPU power usage monitoring. The controller activates the TEC only when CPU power usage exceeds a threshold, and switches to the second thermal block when power usage is low. This dynamic control maintains adequate thermal performance while minimizing power consumption by avoiding unnecessary TEC operation.
Solution Approach 2:
The system changes operational parameters (which thermal block is active) based on CPU power usage conditions. By monitoring power usage and switching between different cooling configurations, the system maintains thermal performance across different operating conditions while optimizing power consumption by activating the TEC only when necessary.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling capacity and reduces power consumption and noise by efficiently managing thermal management with the dual thermal block system, allowing for higher CPU performance without constant TEC activation.
Implementation Method 1
The first thermal block has a first fluid passageway and the second thermal block has a second fluid passageway. When the TEC is deactivated, cooling liquid is pumped through the second thermal block, which is closer to the CPU than the first thermal block and, thus, can more effectively absorb the heat from the CPU
Implementation Method 2
A liquid cooling system with a first thermal block, a thermoelectric cooler (TEC), and a second thermal block is disclosed. In the second mode, the valve directs the liquid to the first thermal block but not the second thermal block. This prevents or reduces the ability of the liquid in the second fluid passageway from removing cooling energy that could otherwise be used to cool the CPU
Implementation Method 3
The cooling liquid absorbs heat from the CPU, thereby reducing the temperature of the CPU and/or keeping the CPU closer to ambient temperature. The liquid cooling system pumps the heated cooling liquid through a radiator.
Data Source
AI summary
Liquid cooling systems and coolers for electronic devices are disclosed herein. An example cooler includes a first thermal block having a first fluid passageway, a second thermal block having a second fluid passageway, and a thermoelectric cooler (TEC) coupled between the first thermal block and the second thermal block. The second thermal block is to be disposed on a processor of an electronic device such that the second thermal block is disposed between the TEC and the processor.