Dual Thermal Sensor Latch Circuit for Stable Chip Temperature Control
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Solution Overview
Problem
Conventional devices experience chaotic communication between chips and control circuits due to drastic temperature changes, leading to frequent chip shutdowns and device failures.
Innovation Solution
A temperature delay device comprising thermal sensors, an inverter, and a latch circuit that measures and differentiates chip temperatures to output signals that control the chip's state, preventing shutdowns by maintaining a stable temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional temperature control is used without delay mechanism, then response speed is fast, but communication stability deteriorates due to drastic temperature changes
Solution Approach 1:
The patent applies preliminary action by using thermal sensors to detect temperature changes before they cause chip shutdown, and using a latch circuit to preemptively control the shutdown signal. The system anticipates temperature-induced failures and takes preventive action by delaying the shutdown response until temperature stabilizes, thus maintaining communication stability while still protecting the chip.
2Reliability
If temperature delay control is implemented, then communication stability is improved, but device complexity increases due to additional circuits
Solution Approach 1:
The patent segments the temperature control function into distinct modular components: thermal sensors for temperature detection, an inverter for signal processing, and a latch circuit for delay control. This segmentation allows each component to perform a specific function independently, making the overall system more manageable and maintainable while achieving stable communication through coordinated operation of these modules.
3Measurement precision
If multiple thermal sensors are used to measure different temperatures, then temperature control precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies local quality by placing thermal sensors at different locations within the chip to measure local temperature variations. The first thermal sensor measures a first temperature at one location while the second thermal sensor measures a second temperature at another location. This localized temperature monitoring enables precise control of temperature gradients across the chip, improving overall temperature management precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes chip operations by locking states during temperature fluctuations, preventing shutdowns and ensuring continuous device functionality.
Implementation Method 1
The first thermal sensor is configured to measure a first temperature of a chip to output a first input signal
Implementation Method 2
The second thermal sensor is configured to measure a second temperature of a chip to output a second input signal
Implementation Method 3
The inverter is coupled to the first thermal sensor, and is configured to reverse the first input signal so as to output a third input signal
Data Source
AI summary
A temperature delay device includes a first thermal sensor, a second thermal sensor, an inverter, and a latch circuit. The first thermal sensor is configured to measure a first temperature of a chip to output a first input signal. The second thermal sensor is configured to measure a second temperature of the chip to output a second input signal. The inverter is coupled to the first thermal sensor, and is configured to reverse the first input signal so as to output a third input signal. The latch circuit is coupled to the inverter and the second thermal sensor, and is configured to output an output signal according to the second input signal and the third input signal. The first temperature is different from the second temperature.