Dual Thermal Modeling for Offline Electronic Component Temperature Estimation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing industrial control systems face challenges in accurately determining the temperature of electronic components, especially when the supply unit is without current, leading to unreliable temperature estimates upon restart.
Innovation Solution
The implementation of a dual thermal modeling approach, where a superordinate computing unit calculates a second temperature using a more detailed thermal model, ensuring accurate temperature determination even when the supply unit is offline.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the supply unit calculates temperature using a first thermal model when online, then temperature determination is available during operation, but the temperature cannot be determined if the supply unit is without current
Solution Approach 1:
A superordinate computing unit is introduced as an intermediary to perform temperature calculations when the supply unit is offline. This external computing entity receives operational data and calculates temperatures using a second thermal model, providing temperature determination capability across all operation modes including when the supply unit has no current.
2Measurement precision
If a detailed thermal model is used for accurate temperature calculation, then measurement precision improves, but device complexity increases
Solution Approach 1:
The thermal modeling is segmented into two approaches: a first thermal model used by the supply unit for basic temperature calculation during operation, and a second thermal model used by the superordinate computing unit for more accurate temperature determination when needed. This segmentation allows the system to use detailed models only when necessary, balancing accuracy with computational resources.
Data Source
AI summary
An arrangement includes a supply unit of an industrial control system and a superordinate computing unit assigned to the supply unit. The supply unit includes an electronic assembly which includes an electronic component. The supply unit is configured to calculate a first temperature of the electronic component using a first thermal model. The superordinate computing unit is configured to calculate a second temperature of the electronic component using a second thermal model when the supply unit is without current, with the supply unit providing the superordinate computing unit with relevant data for a calculation of the second thermal model. The supply unit and the superordinate computing unit interact in such a way that at least one of the first temperature and the second temperature of the electronic component is calculated.