Dual-Thickness Substrate Design for Display Device Dead Space Reduction
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Solution Overview
Problem
Display devices face challenges in minimizing dead space due to stress accumulation during the incising process, leading to potential substrate breakage and increased non-display areas, especially when substrate thickness exceeds 0.3 mm.
Innovation Solution
The display device design features a first and second substrate with varying thicknesses, where the center portion is thicker than the external portion, and a sealing area with a cutting line positioned 50 μm to 100 μm away from the edge, allowing for a thinner external portion and reducing dead space by optimizing the cutting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate thickness is increased to 0.3 mm or more, then the strength and durability of the display device is improved, but stress accumulates during the incising process causing edges of the substrate to break
Solution Approach 1:
The substrate is designed with different thicknesses in different regions: the external portion has a first thickness (0.2-0.3mm) suitable for incising, while the center portion has a second thickness (0.3-0.5mm) providing strength. This local variation in thickness allows the substrate to simultaneously achieve ease of incising at edges and structural strength at the center.
2Reliability
If the incising position is separated from the sealing portion by a predetermined distance, then substrate breakage is prevented, but the dead space in the non-display area widens
Solution Approach 1:
The thinner external portion of the substrate (first thickness) is specifically designed in the region where incising occurs, allowing the cutting line to be positioned closer to the sealing portion without causing breakage. This localized thickness optimization enables reduced dead space while maintaining substrate integrity during incising.
3Productivity
If the external portion of the substrate is made thinner, then dead space is reduced and productivity is improved, but the overall substrate strength may be compromised
Solution Approach 1:
The substrate employs a dual-thickness structure where the external portion (first thickness) is optimized for easy processing and reduced dead space, while the center portion (second thickness) provides the necessary structural strength. This local differentiation allows the external portion to be thinner without compromising overall substrate strength.
Solution Approach 2:
The substrate is segmented into two distinct thickness regions: an external portion with first thickness and a center portion with second thickness. This segmentation allows each region to be optimized for its specific function - the external portion for easy incising and reduced dead space, and the center portion for structural support.
Data Source
AI summary
A display device according to some exemplary embodiment includes: a display area; a non-display area surrounding the display area and including a sealing area; a first substrate including a center portion including a portion in the display area and an external portion including a portion in the sealing area; a second substrate including a center portion including a portion in the display area and an external portion including a portion in the sealing area; and a sealing portion between the first substrate and the second substrate and in the sealing area, wherein a thickness of the center portion of the first substrate is different from a thickness of the external portion of the first substrate, and a thickness of the center portion of the second substrate is different from a thickness of the external portion of the second substrate.