Dual Transceiver Module Sharing Baseband for Millimeter Wave
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current millimeter wave (mmW) wireless communication systems require separate circuitry and hardware for each transceiver configuration, leading to increased hardware footprint and power consumption due to the use of multiple modules and boards for different frequency ranges, which complicates design and operation, especially in devices with limited space.
Innovation Solution
A dual-transceiver module configuration where two transceivers, each with different frequency ranges, share a baseband sub-module via a single coaxial cable, with one transceiver using a zero-intermediate frequency (ZIF) architecture and the other using a sliding-intermediate frequency (SIF) architecture, allowing for reduced hardware footprint and shared baseband processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate circuitry and hardware are used for each transceiver configuration, then communication on different frequency ranges is enabled, but hardware footprint and device complexity increase
Solution Approach 1:
The patent merges two separate transceiver configurations (ZIF and SIF) into a single integrated transceiver module that can operate on different frequency ranges. The baseband circuitry is shared between both configurations, while only the RF front end components differ, thereby reducing overall hardware footprint while maintaining adaptability to communicate on multiple frequency ranges including mmW bands.
Solution Approach 2:
The transceiver is designed with universal baseband circuitry that can support multiple transceiver configurations (ZIF and SIF) through software or configuration control. This multi-functional baseband unit eliminates the need for separate dedicated circuitry for each frequency range, allowing a single hardware platform to adapt to different communication standards and frequency bands.
2Adaptability or versatility
If separate circuitry and hardware are used for each transceiver configuration, then communication on different frequency ranges is enabled, but device complexity increases
Solution Approach 1:
The patent merges two separate transceiver configurations (ZIF and SIF) into a single integrated transceiver module that can operate on different frequency ranges. The baseband circuitry is shared between both configurations, while only the RF front end components differ, thereby reducing overall hardware footprint while maintaining adaptability to communicate on multiple frequency ranges.
Solution Approach 2:
The transceiver is designed with universal baseband circuitry that can support multiple transceiver configurations (ZIF and SIF) through software or configuration control. This multi-functional baseband unit eliminates the need for separate dedicated circuitry for each frequency range, allowing a single hardware platform to adapt to different communication standards and frequency bands.
3Adaptability or versatility
If multiple modules and boards are used for different frequency ranges, then communication capability is improved, but power consumption increases
Solution Approach 1:
The patent merges two separate transceiver configurations (ZIF and SIF) into a single integrated transceiver module that can operate on different frequency ranges. The baseband circuitry is shared between both configurations, while only the RF front end components differ, thereby reducing overall hardware footprint while maintaining adaptability to communicate on multiple frequency ranges.
Solution Approach 2:
The transceiver is designed with universal baseband circuitry that can support multiple transceiver configurations (ZIF and SIF) through software or configuration control. This multi-functional baseband unit eliminates the need for separate dedicated circuitry for each frequency range, allowing a single hardware platform to adapt to different communication standards and frequency bands.
Data Source
AI summary
Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.


